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Paraffin phase change heat storage temperature adjusting device for semiconductor technology temperature control equipment

A temperature adjustment device and temperature adjustment technology, which are applied in lighting and heating equipment, machines using electromagnetic/magnetic effects, and machine operation modes, etc., can solve problems such as high operating costs, increased electrical power of attached equipment, and energy waste, etc. Achieve high heat exchange efficiency, stable heat, and reduce energy consumption

Inactive Publication Date: 2017-07-21
BEIJING JINGYI AUTOMATION EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 1. The temperature control device mainly adjusts the amount of refrigerant passing through the evaporator 4 through the opening of the electronic expansion valve 3, thereby cooling the heat brought by the brine. It is lower than the working temperature required by the main process equipment for semiconductor product production, so it is necessary to heat and adjust the temperature of the supercooled brine through the electric heater 6. On the one hand, the compressor 1 needs to reduce the heat brought by the brine Therefore, it needs to consume a certain amount of electric energy. On the other hand, using the electric heater 6 for heat balance will consume a large amount of electric energy, resulting in an increase in the electric power of the attached equipment and a large current. The selection of electrical appliances and cables are correspondingly increased. , coupled with the usual high operating costs, is undoubtedly a huge burden for semiconductor manufacturers
[0008] 2. The factory water required by the condenser 2 is a special chiller attached to the semiconductor production enterprise to condense the waste heat generated by the exhaust of the compressor, and the heat taken away by the condensed factory water needs to consume a certain amount of electric energy , is also a waste of energy

Method used

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  • Paraffin phase change heat storage temperature adjusting device for semiconductor technology temperature control equipment
  • Paraffin phase change heat storage temperature adjusting device for semiconductor technology temperature control equipment
  • Paraffin phase change heat storage temperature adjusting device for semiconductor technology temperature control equipment

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Embodiment Construction

[0019] A paraffin phase change heat storage temperature adjustment device for semiconductor process temperature control equipment proposed by the present invention is further described as follows in conjunction with the accompanying drawings and specific examples:

[0020] A paraffin phase change heat storage temperature adjustment device 16 for semiconductor process temperature control equipment proposed by the present invention uses the phase change characteristics of paraffin to absorb heat in liquefaction and release heat in solidification, and use the latent heat of phase change to store heat instead of figure 1 The electric heater in the shown existing temperature control equipment is used, and the structural representation of the present invention is as follows figure 2 As shown, the temperature regulator includes a casing 25 and a plurality of temperature regulation units located in the casing; compressor exhaust heat exchange chambers are provided between two adjacent...

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Abstract

The invention provides a paraffin phase change heat storage temperature adjusting device for semiconductor technology temperature control equipment, and belongs to the technical field of temperature control equipment. The paraffin phase change heat storage temperature adjusting device comprises a shell and multiple temperature adjusting units located in the shell. A compressor exhaust heat exchange cavity is formed between every two adjacent temperature adjusting units, and a compressor exhaust heat exchange cavity is formed between each temperature adjusting unit and the shell. Each temperature adjusting unit comprises a refrigerating medium heat exchange cavity in the middle and paraffin heat storage cavities located in the two sides of the refrigerating medium heat exchange cavity. The upper end and the lower end of each paraffin heat storage cavity communicate through a paraffin communicating pipe. The two ends of each refrigerating medium heat exchange cavity are provided with a refrigerating medium liquid outlet pipe connector and a refrigerating medium liquid inlet pipe connector correspondingly. The two ends of each compressor exhaust heat exchange cavity are provided with a compressor exhaust gas inlet pipe connector and a compressor exhaust gas outlet pipe connector correspondingly. According to the device, heat in compressor exhaust waste heat is stored in paraffin, the paraffin achieves heating and temperature adjusting on a refrigerating medium in the phase change process, and the temperature control equipment is more economical and environment-friendly and saves more energy; and loads of a cooling-water machine attached to a semiconductor enterprise can be reduced, and energy consumption is further reduced.

Description

technical field [0001] The invention belongs to the technical field of temperature control equipment, and in particular relates to a paraffin phase change thermal storage temperature adjustment device used for semiconductor process temperature control equipment, and more specifically relates to a device that utilizes the exhaust waste heat of a compressor to store heat through paraffin phase change. A device for temperature regulation of brine. Background technique [0002] In the production and processing of semiconductor products such as chips, wafers, liquid crystal panels, and integrated circuits, the main process equipment for semiconductor product production has very strict requirements on processing temperature. During the processing of semiconductor products, the main process equipment needs to maintain a constant ambient temperature. If the temperature fluctuation of the supporting temperature control equipment is too large, it will cause waste and defective product...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B21/02F25B49/02
CPCF25B21/02F25B49/02
Inventor 芮守祯何茂栋张申刘紫阳孙华敏赵力行邹昭平蒋俊海于浩
Owner BEIJING JINGYI AUTOMATION EQUIP CO LTD
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