Flexible magnetron sputtering coating transverse uniformity control device

Abstract

The invention discloses a flexible magnetron sputtering coating transverse uniformity control device. A spray nozzle row is provided with gas spray nozzles. Multiple magnetron sputtering degree monitoring probes are arranged and used for detecting the sputtering degree of the gas spray nozzles. The magnetron sputtering degree monitoring probes are connected with the input end of a magnetron sputtering degree analysis and comparison device through a shielding electrical signal output line. The output end of the magnetron sputtering degree analysis and comparison device is connected with a valve opening degree control device through a shielding electrical signal output line. The valve opening degree control device is used for controlling the opening and closing degree of electric valves. Each gas spray nozzle is independently provided with one electric valve. A gas source is sequentially connected with a gas pressure stabilizing device, the electric valves and the gas spray nozzles through a stainless steel tube. The flexible magnetron sputtering coating transverse uniformity control device can control that the sputtering degrees at all transverse points are identical, so that the gas distribution density of each corresponding point is controlled, the purpose of controlling the deposition rate of each transverse corresponding point is achieved, and therefore the performance indexes at all the transverse points are uniform and identical.

Description

technical field [0001] The technology relates to a flexible magnetron sputtering coating lateral uniformity control device, which belongs to the technical field of magnetron sputtering coating. Background technique [0002] The principle of magnetron sputtering is that electrons collide with argon atoms in the process of accelerating to the substrate under the action of an electric field, ionize a large number of argon ions and electrons, and the electrons fly to the substrate, and the argon ions accelerate bombardment under the action of an electric field Target material, a large number of target atoms are sputtered, and neutral target atoms (or molecules) are deposited on the substrate to form a film. [0003] The working gas system of conventional magnetron sputtering coating is composed of working gas storage tank, gas pressure stabilizer group and gas nozzle. The working gas passes through the pressure stabilizer and then is discharged through the gas nozzle. The press...

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Problems solved by technology

[0008] However, due to the influence of factors such as the uniformity of the magnetic field distribution, the uneven distribution of the vacuum degree of the system, and the release of gas and moisture inside the flexible substrate, the ion concentration on the target surface is uneven, which affects the sputtering degree and causes the sputtering deposition density distribution. Unevenness, which ultimately affects the consistency of the thickness of the coating film on the surface of the substrate

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