A kind of method for anti-adhesive sheet of silicon slice

Abstract

The invention provides a wafer pasting preventing method for a silicon wafer, and belongs to the field of silicon wafer manufacturing processes. Glue preparation, rod pasting, dispersing agent preparing, mortar preparing, anti-viscidity mortar fluid preparing, wafer cutting and glue removal are sequentially carried out. A dispersing agent with charges capable of being removed is prepared, and therefore the viscidity of overall cutting liquid is guaranteed, the accident of wafer pasting in the silicon wafer cutting process is avoided; and a thick sheet is reserved at each of the two ends of a silicon rod after cutting is completed, it is guaranteed that the two ends of the cut silicon wafer are each provided with a balance weight, silicon wafer slippage caused by swelling caused by pasted silicon powder is avoided, and the stability of the overall production process is improved.

Description

technical field [0001] The invention belongs to the field of silicon crystal unit production, and in particular relates to a method for preventing sticking of silicon crystal rods during slicing. Background technique [0002] The eastern part of my country has a monsoon climate. From June to September in the northern region and from May to July in the southern region, due to weather changes and high air humidity, the water in the suspension in the recycled mortar increases during the use of the recycled mortar. The number of times increases, and the moisture content continues to increase. Since the surface of the silicon powder produced by cutting has a certain charge, in the environment where moisture exists, the silicon powder particles produced by cutting in the mortar will undergo electrostatic adsorption, and the silicon powder will produce an association phenomenon, and will wrap part of the silicon carbide particles. The rheological properties of the mortar are change...

AI Technical Summary

Problems solved by technology

At the same time, during the cutting process, the concentration of silicon powder is getting higher and higher, and the action of moisture in the mortar will also cause electrostatic adsorption of silicon powder on the silicon wafer, resulting in viscosity on the silicon wafer, so that the cut silicon wafer will stick. , swelling

[0003] After the mortar is sticky, the silicon wafer will be close to the cutting line during the slicing process, causing sticking and scratch accidents. After the sticking accident occurs, the entire silicon wafer will be scrapped, which will cause a huge waste of manpower and material resources. The technology has not yet provided an effective technical means to prevent sticking