Photoelectric conversion device
A photoelectric conversion device and photodetector technology, applied in the directions of light guides, optics, optical components, etc., can solve problems such as affecting the transmission rate of devices, and achieve the effects of optimizing device performance, small size, and simple structure
Inactive Publication Date: 2017-08-18
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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Problems solved by technology
[0003] Detector chips are usually directly coupled by lens. However, for detector chips with general structures, in order to achieve direct coupling by lens, the detector chip needs to be three-dimensionally packaged, and during the transmission of microwave signals, microwave signals A 90° turn is required, which seriously affects the transmission rate of the device; another coupling method for the detector chip is to turn the optical path by 90°, and attach the detector chip directly to the coplanar waveguide, which requires a gold wire Connect the electrodes of the detector chip with the coplanar waveguide, but gold wire bonding will introduce parasitic inductance, which will also affect the transmission rate of the device
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[0058] Such as Figures 1(a) to 1(d) As shown, this embodiment proposes a four-way integrated photoelectric conversion device, including a V-groove substrate 1 , a coplanar waveguide 2 , four 45° inclined optical fibers 3 , and four detector chips 5 .
[0059] Among them, as shown in Figure 1(a), the V-groove substrate 1 has four periodically arranged V-shaped grooves 11 for fixedly placing four 45° inclined optical fibers 3; the coplanar waveguide 2 has four groups of periodically arranged transmission lines 51, and it is a gradient structure; as shown in Figure 1(c), four detector chips 5 are flip-chip welded on the upper surface of the coplanar waveguide 2 through the welding pillar 4, so as to be arranged periodically on the coplanar waveguide 2, and Figure 1(d) and figure 2 As shown, the electrodes of the four detector chips 5 are respectively connected to four groups of periodically arranged transmission lines 51 through the welding posts 4; The spacing is small, and t...
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The invention discloses a photoelectric conversion device. The photoelectric conversion device comprises a photoelectric detector, a coplanar waveguide, and an optical coupling structure. The photoelectric detector is disposed on the surface of the coplanar waveguide by adopting a flip-chip bonding technology, and the electrode of the photoelectric detector is connected with the transmission line of the coplanar waveguide. The optical coupling structure is used for optical coupling of transmitted signals to the photosensitive surface of the photoelectric detector. The optical coupling structure comprises a V-shaped slot substrate and at least one optical fiber having a 45-degree inclined surface. The V-shaped slot substrate is provided with a plurality of periodically-arranged V-shaped slots, and each of the V-shaped slot grooves is used to fix any one of the at least one optical fiber having the 45-degree inclined surface. The photoelectric detector is buckled on the surface of the coplanar waveguide in an inverted manner by adopting the flip-chip bonding technology, and the electrode of the photoelectric detector is connected with the transmission line of the coplanar waveguide by adopting the flip-chip bonding technology, and therefore parasitic inductance influences caused by gold wire bonding during a common packaging process are reduced, and the performance of the device is optimized.
Description
technical field [0001] The invention belongs to the field of optoelectronic / microelectronic devices, and more specifically relates to a photoelectric conversion device. Background technique [0002] With the rapid growth of broadband traffic, optical communication devices are developing toward integration, small size, large capacity, and high speed. The development trend of high integration makes device array integration a research hotspot. The detector receiving module is the core part of the optical fiber communication network receiver, and its structure directly determines the performance of the device. [0003] Detector chips are usually directly coupled by lens. However, for detector chips with general structures, in order to achieve direct coupling by lens, the detector chip needs to be three-dimensionally packaged, and during the transmission of microwave signals, microwave signals A 90° turn is required, which seriously affects the transmission rate of the device; ...
Claims
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IPC IPC(8): G02B6/42
CPCG02B6/4245G02B6/4204G02B6/421G02B6/4237
Inventor 赵泽平刘宇张志珂张一鸣祝宁华
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI