System for and method of processing transparent materials by using laser beam focal lines adjustable in length and diameter

A transparent material, laser beam technology, used in laser welding equipment, metal processing equipment, optics, etc., can solve problems such as time-consuming and limiting output

Active Publication Date: 2017-08-18
CORNING INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This laser cutting process can be time consuming and thus limit output

Method used

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  • System for and method of processing transparent materials by using laser beam focal lines adjustable in length and diameter
  • System for and method of processing transparent materials by using laser beam focal lines adjustable in length and diameter
  • System for and method of processing transparent materials by using laser beam focal lines adjustable in length and diameter

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Embodiment Construction

[0029] Embodiments described herein relate to methods and systems for optically producing high-precision cuts in or through transparent materials. Subsurface damage from the cutting process can be limited to a depth of 60 microns or less, and cutting can generate only a small amount of debris. Cutting transparent materials with a laser according to the present disclosure may also be referred to herein as drilling or laser drilling or laser machining. A material is substantially transparent to the laser wavelength when the absorption at this wavelength is less than about 10%, preferably less than about 1%, per millimeter of material depth.

[0030] Typically, a laser beam is transformed into a laser beam focal line positioned within a block of material, such as glass, to create a defect line within the material. The material can then be separated along these defect lines. The laser beam focal line can also be used to make holes in materials, such as holes in interposers of se...

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Abstract

A system for and a method of processing a transparent material, such as glass, by using an adjustable laser beam line focus are disclosed. The system for processing the transparent material includes a laser source operable to emit a pulsed laser beam, and an optical assembly (6') disposed within an optical path of the pulsed laser beam. The optical assembly (6') is configured to transform the pulsed laser beam into a laser beam focal line having an adjustable length and an adjustable diameter. At least a portion of the laser beam focal line is operable to be positioned within a bulk of the transparent material such that the laser beam focal line produces a material modification along the laser beam focal line. Method of laser processing a transparent material by adjusting at least one of the length of the laser beam focal line and the diameter of the laser beam focal line is also disclosed.

Description

[0001] Cross References to Related Applications [0002] This application claims priority under 35 U.S.C. §119 to U.S. Provisional Application No. 62 / 024122, filed July 14, 2014, the contents of which are incorporated herein by reference in its entirety. Background technique [0003] In recent years, improvements in precision micromachining and its process development in order to meet customer demands to reduce the size, weight and material cost of cutting-edge devices have led to high-tech applications in flat-panel displays used in touch screens, tablets, smartphones and televisions. Rapid growth of the industry. Ultrafast industrial lasers are becoming important tools for applications requiring high-precision micromachining. [0004] There are various known ways to cut glass. In conventional laser glass cutting processes, the separation of glass relies on laser scribing or perforation followed by crack propagation induced by mechanical force or thermal stress. Almost all...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/00B23K26/06B23K26/067B23K26/073C03B33/02G02B5/00G02B27/09
CPCB23K26/0006B23K26/0613B23K26/0676B23K26/0732B23K26/0738C03B33/0222G02B5/001G02B27/0911G02B27/095G02B27/0977B23K2103/54G02B15/14G02B7/14G02B15/143B23K26/0648B23K26/0734G02B7/10G02B27/0927
Inventor J·高里尔G·A·皮切
Owner CORNING INC
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