Copper alloy target

A copper alloy target and metal material technology, applied in metal material coating process, ion implantation plating, coating and other directions, can solve the problems of difficult target utilization, poor operability, productivity and safety, etc. The effect of reducing abnormal discharge and good weldability

Active Publication Date: 2017-08-18
SUMITOMO METAL MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although it is considered to cut directly from the ingot in the shape of the final product by wire electric discharge machining, it is difficult to directly use it as a target due to the large number of holes in the ingot
In addition, although vacuum melting and vacuum casting are considered to remove voids inside the ingot, under vacuum conditions, silver is vapor-deposited on the inner wall of the melting furnace cavity, inspection window, oscillation coil, electrode terminals, etc. Partly, therefore, there is a problem that operability, productivity, and safety are significantly deteriorated

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0046] Hereinafter, the present invention will be described in more detail using examples and comparative examples, but the present invention is not limited to the following examples at all.

[0047] "Examples and Comparative Examples"

manufacture example 1

[0049] In Examples and Comparative Examples, copper alloy melts were prepared so as to have the component compositions shown in Table 1 below, and copper alloy samples were produced. In addition, as shown in Table 1, as a component, silver and nickel were contained in predetermined ratios, respectively.

[0050] Specifically, using a high-frequency vacuum melting furnace, after evacuating the cavity to below 0.009Pa, introducing argon gas to 500Pa to produce a copper alloy melt with the composition shown in Table 1 below, at the pressure After being kept under the same conditions for 10 minutes, it was poured into a graphite mold to make an ingot. Then, a disc shape with a thickness of 5 mm and a diameter of 75 mm was cut out from the produced ingot as a copper alloy target, and was used for the following evaluation.

[0051]

[0052] Using the prepared copper alloy target, a film was formed on a monel plate (Ni-34% by mass Cu) by the sputtering method, and the solder wetta...

manufacture example

[0064] "Manufacturing example (reference example) 2 to 4"

[0065]

[0066] For reference, Manufacturing Example 2 employs the same composition as that of the copper alloy target in Example 1, and the cavity is evacuated and melted in this state. It should be noted that other conditions are the same as in Example 1.

[0067]As a result, silver adhered to the inner side of the inspection window of the cavity, and the inspection window quickly became blurred, and the inside of the cavity could not be observed, and the operation could not be continued. After cooling down, the inside of the chamber was observed, and it was found that silver had adhered not only to the inner wall of the chamber, but also to all parts such as the oscillation coil and electrode terminals, and it was in an unsafe state. It should be noted that the vacuum degree during the melting is 0.4 Pa.

[0068]

[0069] In addition, as Production Example 3, casting was performed with the same composition as...

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PUM

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Abstract

Provided is a copper alloy target for forming a film of an electrode to be soldered, said copper alloy target enabling low-cost formation of a copper alloy film that is not discolored after sputtering different from pure copper films, shows good solder joint properties even after treating with an inert flux, and has an excellent solder wettability. The copper alloy target according to the present invention for forming a film of an electrode to be soldered comprises copper as a main component together with 10-25 mass% exclusive of silver and 0.1-3 mass% inclusive of nickel. The copper alloy target is produced preferably by evacuating a sealable chamber to 0.01 Pa or below, then introducing an inert gas to adjust the pressure in the chamber to 50-90000 Pa inclusive, and then melting and casting metal materials therein.

Description

technical field [0001] The present invention relates to a copper alloy target used for soldering, for example, electronic components, external electrodes of semiconductor elements, etc., and more specifically, to a copper alloy target for welding electrode film formation, which is used for forming electronic components, Copper alloy film suitable for soldering as the outermost film of the external electrodes of semiconductor elements. Background technique [0002] Generally, when soldering an electronic component, an external electrode of a semiconductor element, or the like, soldering is performed in a state of high wettability with solder to an alloy to be connected. [0003] For example, when the alloy that constitutes the skeleton of the connecting part is Fe-42 mass% Ni alloy (42 alloy), the connecting surface is gold-plated; the alloy is Cu-2.4 mass%Fe-0.03 mass%P-0.12 mass%Zn( alloy 194), tin plating should be carried out in addition to silver plating, or palladium p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34B22D21/00C22B9/04C22C1/02C22C9/00H01L21/285
CPCB22D21/00C22B9/04C22C1/02C22C9/00C23C14/34H01L21/285B22D21/025C23C14/3414H01L2021/60007
Inventor 富樫亮山岸浩一渡边宏幸佐藤惠理子
Owner SUMITOMO METAL MINING CO LTD
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