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Integrated structure capable of suppressing leakage current of three-dimensional horizontal cross-point resistance conversion memory

A technology of resistance conversion and cross point, which is applied in the manufacturing of circuits, electrical components, semiconductor/solid-state devices, etc., can solve the problems of energy waste, read and write misoperation, and reduce the reliability of memory, so as to improve reliability and suppress leakage current. , the effect of saving power

Inactive Publication Date: 2017-08-22
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This will not only cause a lot of energy waste, but also bring the risk of read and write misoperations and reduce the reliability of the memory

Method used

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  • Integrated structure capable of suppressing leakage current of three-dimensional horizontal cross-point resistance conversion memory
  • Integrated structure capable of suppressing leakage current of three-dimensional horizontal cross-point resistance conversion memory
  • Integrated structure capable of suppressing leakage current of three-dimensional horizontal cross-point resistance conversion memory

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Experimental program
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Effect test

Embodiment 1

[0044] Below, refer to the attached figure 2 — Figure 4 The integrated structure of Embodiment 1 of the three-dimensional resistive memory array proposed by the present invention will be described.

[0045] In order to ensure the area utilization rate of the memory chip as much as possible, the present invention designs such as figure 2 A schematic of the chip layout is shown. The entire chip is planned as a Bank200. In order to reduce leakage current power consumption, Bank 200 is divided into several Block 201 along the direction of bit line 206, and each Block 201 passes a certain method (in figure 2 not shown) is connected to the bit line 206. The local bit line 205 in each Block201 passes through a certain method (in figure 2 not shown) to the corresponding bit line 206. The word line and horizontal line decoder 204 is placed on both sides of the Bank 200, and its function is to select a Block from all Blocks 201 in the Bank 200, and then provide proper bias fo...

Embodiment 2

[0059] Figure 7 A is a three-dimensional circuit diagram of Embodiment 2 of the present invention, with 4 storage layers in total; Figure 7 In A, the cross-sectional view along the BB' direction is as follows Figure 7 Shown in B; The manufacture of isolation unit does not need to increase extra process step almost, isolation unit 301 (1) can be manufactured simultaneously with the second storage layer or the third storage layer, isolation unit 301 (2) can be with the first layer The storage layer or the second storage layer is manufactured simultaneously; the isolation unit 301(i) has exactly the same structure as the common storage unit, but their functions are different: the common storage unit utilizes the conversion of its high and low resistance states to store data; and the isolation unit 301 (i) It plays the role of suppressing the leakage current in the circuit, and does not pay attention to the resistance state of the isolation unit, and it can be found that any a...

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PUM

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Abstract

The invention relates to the technical field of semiconductor nonvolatile memories, and relates to an integrated structure capable of suppressing the leakage current of a three-dimensional horizontal cross-point resistance conversion memory. The integrated structure comprises first electrode layers, second electrode layers, memory unit layers arranged between the first electrode layers and the second electrode layers, a gate tube which is arranged on a silicon wafer, and an isolation unit, wherein the first electrode layers and the second electrode layers are alternately stacked upward. The isolation unit is arranged in a vertical through hole between the first electrode layers of adjacent odd or even layers. The isolation unit and an ordinary memory unit are completely identical in structure, but have different functions. The ordinary memory unit stores data. The isolation unit suppresses a lot of leakage current generated during the operation process of a circuit. The structure has the advantages of simple manufacturing method and low cost, is free of additional process steps. The power consumption is saved. The memory reliability is improved. The high density advantage of the three-dimensional resistance conversion memory is preserved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor non-volatile memory, and relates to a structural design for suppressing the leakage current of a three-dimensional resistance switching memory during operation, in particular to a multilayer stacked three-dimensional horizontal cross-point resistance switching memory array. Background technique [0002] With the continuous advancement of technology generations, NAND Flash, the mainstream non-volatile memory in the market, is already facing a shrinking dilemma. In order to further realize the low power consumption and high density application goals of non-volatile semiconductor memory devices, researchers have carried out various researches on materials, device structures, manufacturing methods and peripheral circuit designs. Among them, resistance switching memory is considered as a potential non-volatile memory that can break through the bottleneck of FLASH technology due to its high storag...

Claims

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Application Information

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IPC IPC(8): H01L21/8239
CPCH10B99/00
Inventor 林殷茵赵彦卿
Owner FUDAN UNIV