Passivation Process of Nanoscale Damage Precursor on Fused Silica Surface

Abstract

The invention discloses a fused quartz surface nanoscale damage precursor passivation technology. The passivation technology includes the following steps that (1) the surface of a fused quartz element with the RMS roughness Rq smaller than 0.5 nm is subject to plasma washing treatment to remove a hydrolysis layer on the surface of the fused quartz element, and a nanoscale damage precursor on the sub surface of the fused quartz element is exposed out; and (2) the surface of the fused quartz element treated in the step (1) is subject to plasma passivation treatment, and nanoscale damage precursor passivation is carried out. The technology has the beneficial effects that the technological process is simple, the maneuverability is high, the nanoscale damage precursor on the fused quartz surface can be removed, and secondary pollution of the surface of the element can be avoided; and by means of the technology, the optical element with the high accuracy and the high surface quality can be machined, and the laser damage resistant capacity of the fused quartz element is effectively improved.

Description

technical field [0001] The invention belongs to the technical field of fused silica surface polishing, and in particular relates to a passivation process of a nanoscale damage precursor on the surface of fused silica. Background technique [0002] Since fused silica components are widely used in high-precision strong light optical systems, the system has extremely high requirements on the surface quality and surface accuracy of the components. Under intense laser irradiation, the laser-induced damage of fused silica optical elements will severely limit its development in high-light optical systems. Therefore, it has important engineering requirements and application prospects to carry out research on laser-induced damage of fused silica components and realize high-threshold processing of fused silica components. The damage research shows that under strong laser irradiation, the damage precursors on the surface of the fused silica element will cause local light absorption en...

AI Technical Summary

Problems solved by technology

However, although MRF polishing can effectively remove broken defects such as subsurface scratches, it will introduce metal pollution such as Fe and Ce.

HF acid etching and other processes can effectively remove pollution through reaction, but HF will destroy the surface shape of the element, and the redeposition of the reaction product with fused silica will cause secondary pollution on the surface of the element

However, metal contamination such as Fe and Ce and redeposited compounds introduced in these post-treatment processes are often at the nanometer scale, and the loss induced by high-flux irradiation limits the further improvement of the threshold.

Therefore, the existing post-processing technology is difficult to achieve the processing purpose of further increasing the threshold value. Therefore, it is urgent to introduce a new processing technology that does not introduce secondary pollution and can improve the nanoscale damage precursor to solve these technical problems.

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