A method for electroplating diamond wire cutting silicon wafers
A diamond wire cutting and diamond wire technology, applied in metal processing equipment, fine working devices, grinding machines, etc., can solve the problem of low efficiency in cutting silicon wafers, achieve the effects of reducing cutting time, reducing production costs, and increasing production capacity
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Embodiment 1
[0049] Table 1 Example 1 cutting experiment data
[0050]
Embodiment 2
[0052] The difference with embodiment 1 is:
[0053] Step (2) Mix the purchased Gaote cutting fluid, Defeng defoamer, and water according to the mass ratio of 1:1:300, pour it into the cooling liquid tank, and set it aside.
[0054] Such as image 3 As shown, it is an electron micrograph of the electroplated diamond wire used in this embodiment. In this embodiment, the electroplated diamond wire with a diameter of 70um is used as the cutting line, and the diamond particle density on the electroplated diamond wire is 300 ± 20 / mm , The diameter of the diamond particles is 8±2um, and the height of the diamond particles is 4.5um.
[0055] Before cutting, set the cutting depth to 6mm, and adjust the coolant flow rate to 0.5L / min. When the cutting depth reaches 6mm, the coolant flow rate is 160L / min.
[0056] During the cutting process, the cutting tension of the electroplated diamond wire is 12N, the line speed of the electroplated diamond wire is 1400m / min, the feed cutting spee...
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