PCB circuit board surface processing method

Abstract

The invention discloses a PCB circuit board surface processing method. The method comprises the steps that (a) after PCB circuit board molding, first degreasing, cleaning and drying are carried out; (b) a PCB circuit board is micro-etched by a micro-etching liquid, so that the copper surface is slightly coarsened; (c) a fixture clamps the PCB circuit board and places the PCB circuit board into an ultrasonic cleaning tank, and after cleaning with board washing water, drying is carried out; (d) a three-proofing paint is uniformly modulated, and the PCB circuit board is painted and brushed; and (e) after brushing is completed, the PCB circuit board keeps clean until the PCB circuit board is completely cured. The three-proofing paint is painted on the circuit board. The circuit board is cured to form a transparent protective film. The PCB circuit board has the properties of insulation, moisture proofing, leakage proofing, shock proofing, dust proofing, corrosion proofing, circuit aging proofing, corona resistance and the like.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a surface treatment method for a PCB circuit board. Background technique [0002] PCB circuit boards can realize automatic insertion or placement of electronic components, automatic soldering, and automatic detection, which ensures the quality of electronic equipment. Therefore, it is used in the fields of circuit automation, computers, electrical appliances, etc. Applications. The surface treatment process of the PCB circuit board directly affects its quality in practical applications. In the prior art, the following treatment methods are usually used: 1. Tin spray treatment, which has a low cost and can guarantee a long storage time, and It is suitable for lead-free soldering, but because of its surface flatness, it has limitations in SMT, and is not suitable for contact switch design, and the board will withstand a high temperature, and the copper will dissolve during tin sprayi...

AI Technical Summary

Problems solved by technology

The surface treatment process of the PCB circuit board directly affects its quality in practical applications. In the prior art, the following treatment methods are usually used: 1. Tin spray treatment, which has a low cost and can guarantee a long storage time, and It is suitable for lead-free soldering, but because of its surface flatness, it has limitations in SMT, and is not suitable for contact switch design, and the board will withstand a high temperature, and the copper will dissolve during tin spraying; 2. OSP, which is simple to make and has a special surface Flat, suitable for lead-free soldering and SMT, easy to rework and secondary treatment, but its storage conditions are high, and it is not suitable for crimping for wire bonding; 3. Chemical silver surface treatment, its production is simple, suitable for lead-free soldering and SMT, The cost is low, but its storage conditions are high, it is easy to be polluted and corroded, and it is prone to electromigration and Giavanni bite corrosion of copper under the solder mask