Manufacturing method for humidity sensor and humidity sensor manufactured by using method

Abstract

The invention provides a manufacturing method for a humidity sensor and the humidity sensor manufactured by using the method. The manufacturing method comprises the following steps: forming a conductive zero layer on a silicon wafer substrate by using an ion implantation method and high-temperature annealing; growing a first silicon oxide dielectric layer on the conductive zero layer; forming first contact holes in the first silicon oxide dielectric layer; depositing a first metal film layer on the first silicon oxide dielectric layer by a physical vapor deposition method, and connecting the first metal film layer with the conductive zero layer through the first contact holes; forming a heating resistor, depositing a second silicon oxide dielectric layer, and forming second contact holes penetrating through the second silicon oxide dielectric layer; depositing a second metal film layer, and connecting the second metal film layer with the first metal film layer through the second contact holes; forming an interdigital capacitor; depositing a third silicon oxide dielectric layer; coating a humidity-sensitive polyimide film material. The manufacturing method provided by the invention has the beneficial effects that the heating resistor can be used for heating a humidity-sensitive capacitor and evaporating out excess water, so that the humidity sensor restores normal functions.

Description

technical field [0001] The invention relates to a manufacturing method of a sensor, in particular to a manufacturing method of a humidity sensitive sensor and a humidity sensitive sensor manufactured by the method. Background technique [0002] The method of making a humidity sensor with a humidity sensitive capacitor has been studied for a long time, and related patents have also been applied for and granted. However, the traditional humidity sensor has several problems: (1) Sometimes the humidity sensor accidentally enters water, or is exposed to a high humidity environment for a long time, and the humidity sensor will work abnormally. (2) The humidity-sensing capacitance of the traditional humidity sensor is relatively small, the ability to resist external interference is weak, and the error is relatively large, so the measurement accuracy cannot be improved. (3) After the humidity sensor is packaged, it is necessary to leave a window to connect the sensitive unit with t...

AI Technical Summary

Problems solved by technology

However, the traditional humidity sensor has several problems: (1) Sometimes the humidity sensor accidentally enters water, or is exposed to high humidity for a long time, and the humidity sensor will work abnormally

(2) The humidity sensitive capacitance value of the traditional humidity sensor is relatively small, the ability to resist external interference is weak, and the error is relatively large, so the measurement accuracy cannot be improved

Due to the uneven thickness of the chip and the thickness of the metal frame of the package, the height of the chip will change. Therefore, the process of pressing the chip by the ejector pin usually crushes the chip due to excessive pressure, or introduces plastic packaging due to too low pressure of the ejector pin because the chip height is too low. materials, resulting in a large number of defective or waste products

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