Method for preparing multifunctional protective nano-coating through cyclic, periodical and alternate discharging

Abstract

The invention provides a method for preparing a multifunctional protective nano-coating through cyclic, periodical and alternate discharging, and belongs to the technical field of plasma. According to the method, a reaction chamber is vacuumized, and inert gas is introduced into the reaction chamber; a base material is made to move in the reaction chamber; monomer steam is introduced into the reaction chamber for chemical vapor deposition, and the deposition process includes a pretreatment stage and a film plating stage; in the pretreatment stage, plasma discharges continuously at the high power; in the film plating stage, the plasma discharges periodically and alternately; and the pretreatment stage and the film plating stage repeated cyclically at least once. In the technological process of film plating, more active sites are introduced onto the surface of the base material cyclically, effective film plating is improved, the film structure is more compact, the nano-coating of the multi-layer composite structure is obtained, and multiple protection is provided for a product; and on the microscopic level, the coating structure is more compact, and on the macroscopic level, the coating has excellent hydrophobicity, adhesive force, acid and alkali resistance, mechanical performance, and moisture and heat resistance.

Description

technical field [0001] The invention belongs to the technical field of plasma chemical vapor deposition, and in particular relates to a method for preparing a multifunctional nano protective coating. Background technique [0002] Corrosive environments are the most common cause of damage to electronic devices. Corrosion of solid materials in electronic devices, reduction of conductor / semiconductor insulation, and failure phenomena such as short circuit, open circuit or poor contact due to environmental corrosion. At present, in the products of high-tech industries such as national defense and aerospace, the proportion of electronic components is increasing, and the requirements for moisture-proof, mildew-proof and corrosion resistance of electronic products are becoming more and more stringent. In the field of communication, with the continuous advancement of technology, the continuous increase of communication frequency, the heat dissipation of communication equipment, and...

AI Technical Summary

Problems solved by technology

[0012] The British P2i company has developed a polymer nano-coating based on a specific small duty cycle pulse discharge method using chemical vapor deposition technology. The duty cycle is less than 1:1000. The preparation process of the method can not realize the effective coordination and control of the bond length, bond energy, molecular weight of the material and energy supply of different groups in the chemical raw materials, and the scratch resistance and durability of the prepared coating are not ideal.

It is also due to the performance limitation of the coating that the current coating can only form a lyophobic nano-coating on electronic and electrical equipment, and the corrosion resistance caused by the environment cannot be effectively solved.

Moreover, the dense protective coating prepared based on a specific small duty cycle pulse discharge method has a fatal disadvantage: from a microscopic point of view, the small power density in the coating process is not conducive to the formation of a dense structure, and even cannot form a stable film. Structure; from a macro point of view, a small power density is not conducive to the large rate growth of the coating, and the efficiency is low in actual production, which limits its application

[0013] In the existing plasma chemical vapor deposition coating preparation process, the substrate is fixed, and the movement state of the substrate has no correlation with the discharge energy of the plasma; the static substrate in the chamber is treated by the continuous discharge method, The activated chain scission in the monomer is generally combined into a film through simple stacking under the action of continuous discharge, and the resulting coating generally has a loose structure, or even a high degree of powderization, which is not conducive to the formation of a microscopic dense structure of the coating. Therefore, the coating’s Waterproof, moisture-proof, corrosion-resistant, solvent-resistant and other protective properties are poor

[0014] Due to the regional differences in plasma density and chemical raw material density in the reaction chamber, the static substrate will also lead to slow coating deposition in some areas, low production efficiency, and large differences in uniformity and compactness.

Images