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Flux for lead-free solder, and lead-free solder paste

A brazing and flux technology, applied in the field of lead-free soldering flux and lead-free soldering paste, can solve the problems of reduced preservation stability of flux residue insulation resistive soldering paste, etc., and achieve excellent screen printing adaptability, Avoid the effect of short circuit

Inactive Publication Date: 2017-09-26
ARAKAWA CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, halogen-based activators such as bromine-based activators reduce the insulation resistance of flux residues and the storage stability of solder paste

Method used

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  • Flux for lead-free solder, and lead-free solder paste
  • Flux for lead-free solder, and lead-free solder paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067] A hydrogenated product of acrylated rosin (trade name "KE-604", manufactured by Arakawa Chemical Industry Co., Ltd.) 45% by weight, glutaric acid (manufactured by Tokyo Chemical Industry Co., Ltd.) 1% by weight, an amide-based thixotropic agent (product name "MA-WAX-O", 12-hydroxystearic acid ethylene bisamide, manufactured by KF Trading Co., Ltd.) 6% by weight, 2,2-bis(bromomethyl)-1,3-propanediol 2% by weight %, 1.5% by weight of dioctylamine and 44.5% by weight of hexanediol were mixed and melted under heating to prepare a flux for lead-free soldering.

[0068] Next, 0.1 g of this flux was collected and burned at 1250°C in a commercially available combustion device (product name "Automatic Sample Combustion Device AQF-100", manufactured by Mitsubishi Chemical Analitec Co., Ltd.). The gas is passed into purified water, thereby preparing a sample liquid. Next, this sample liquid was set in a commercially available ion chromatography device (product name "DX-500", manu...

Embodiment 2～13 and comparative example 1～5

[0070] Various fluxes were prepared in the same manner as in Example 1 except that the raw material composition shown in Table 1 was changed.

[0071] (Preparation of lead-free solder paste)

[0072]Commercially available lead-free solder powder (96.5Sn / 3Ag / 0.5Cu, manufactured by Mitsui Kinzoku Co., Ltd., particle size 20-38 μm, common product) and the flux of Example 1 were sequentially added to achieve 89% by weight and 11% by weight. The method is kneading in a softener to prepare solder paste. Also about the fluxes of Examples 2-13 and Comparative Examples 1-5, the solder paste was prepared by the method similar to Example 1.

[0073]

[0074] Using a screw viscometer (product name "PCU-205", coaxial double-layer cylindrical rotary type, manufactured by Malcom Co., Ltd.), the solder pastes of Examples 1 to 13 and Comparative Examples 1 to 5 were measured immediately after preparation. The viscosity of the solder paste and the viscosity after keeping the paste in a cons...

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PUM

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Abstract

The present invention addresses the problem of providing a flux for a lead-free solder, which ensures solder metal wettability while a flux residue generated in a reflow process exhibits excellent insulation resistance and the storage stability of a solder paste is improved. The present invention relates to a flux for a lead-free solder, which contains (A) a rosin-based resin, (B) an activator, (C) a thixotropic agent and (D) a solvent, wherein (B) the activator contains (b1) a dibasic acid activator, (b2) a bromine-based activator and (b3) an amine-based activator represented by general formula (1) R1-NH-R2 (In formula (1), R1 and R2 each independently denote an alkyl group having 6-10 carbon atoms.)

Description

technical field [0001] The present invention relates to flux for lead-free soldering and lead-free solder paste. Background technique [0002] Fluxes for lead-free solder pastes are usually produced by mixing base resins, additives such as activators, thixotropic agents, and solvents. In general, rosin excellent in insulation resistance of residues is often used as the base resin of the flux. In order to improve the wettability of the solder metal in the reflow process, the activity is not sufficient when only rosin is used, so a large amount of activator is added in order to improve the activity of the flux. However, when a large amount of the activator is contained in the flux residue after brazing, the metal plate in contact with the flux may be corroded. In addition, the remaining activator reacts with moisture in the air to cause ion migration, causing problems such as a decrease in insulation resistance. [0003] A water-based soldering flux containing rosin, an ami...

Claims

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Application Information

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IPC IPC(8): B23K35/363B23K35/26C22C12/00C22C13/00C22C13/02
CPCB23K35/262B23K35/3615B23K35/362
Inventor 久保夏希小田刚石贺史男
Owner ARAKAWA CHEM IND LTD
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