Method for producing electronic component, and electronic component
A technology of electronic components and manufacturing methods, which is applied in the fields of fixed capacitor parts, transformer/inductor parts, inductor/transformer/magnet manufacturing, etc. It can solve the problems such as difficult to control the amount of removal, and achieve the effect of process simplification
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Embodiment approach 1
[0093] figure 1 (a) and (b) are diagrams showing the electronic component 1 manufactured by the method of manufacturing the electronic component according to the first embodiment of the present invention.
[0094] The electronic component 1 has a structure in which a pair of external electrodes 20 are arranged at both ends 10a of a chip base 10 including a plurality of magnetic ceramic layers 11 and coils 13 so as to be in conduction with both ends 13a of the coil 13. The coil 13 is formed by interlayer connection of a plurality of internal conductors 12 laminated via the magnetic ceramic layer 11 with via conductors (not shown).
[0095] The external electrode 20 is formed from the end surface 10a of the chip base 10 around a part of the upper surface 10b, the lower surface 10c, and both side surfaces 10d of the chip base 10.
[0096] In addition, the entire electronic component 1 is covered with the insulating layer 30 except for the surface of the external electrode 20 that faces...
Embodiment approach 2
[0134] image 3 (a) and (b) are diagrams showing the electronic component 1 manufactured by the method of manufacturing the electronic component according to the second embodiment of the present invention. In the electronic component 1, the external electrode body 25 is a sintered electrode (thick film electrode) formed by coating and firing a conductive paste containing metal particles and glass. The configuration of the electronic component 1 of the external electrode main body 25 in which the Ni layer covers the surface of the electrode main body 25a made of a resin electrode is different.
[0135] Hereinafter, the electronic component according to the second embodiment will be described.
[0136] Such as image 3 As shown in (a) and (b), the electronic component 1 of the second embodiment is also the same as the case of the electronic component of the above-mentioned first embodiment, except that the surface of the external electrode 20 facing the circuit board or the like to b...
Embodiment approach 3
[0152] Figure 5 (a), (b) is a figure which shows the electronic component 1 manufactured by the manufacturing method of the electronic component concerning Embodiment 3 of this invention. The configuration of the chip base body and the external electrode body of the third embodiment is different from that of the second embodiment. The different configuration will be described below. In addition, since the other structure is the same as that of Embodiment 2, the description is abbreviate|omitted.
[0153] The chip base 10 is composed of a composite material of a resin material and metal powder. The resin material is, for example, an organic insulating material composed of epoxy resin, bismaleimide, liquid crystal polymer, polyimide, or the like. The metal powder is, for example, FeSi-based alloys such as FeSiCR, FeCo-based alloys, Fe-based alloys such as NiFe, or amorphous alloys thereof.
[0154] The external electrode main body 25 is composed of a conductive material 40 provid...
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Abstract
Description
Claims
Application Information
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