Method for preparing multifunctional nanometer protective coating through high-duty-cycle pulse discharge

Abstract

The invention discloses a method for preparing a multifunctional nanometer protective coating through high-duty-cycle pulse discharge, and belongs to the technical field of plasmas. In the method, the interior of a reaction chamber is vacuumized until a vacuum degree is 10-200 millitorrs, inert gas He or Ar is charged, a movement mechanism is started to enable a base material to move in the reaction chamber, monomer steam is charged into the reaction chamber, plasma discharge is carried out, chemical vapor deposition is carried out, a deposition process comprises a pretreatment phase and a film-coating phase, a plasma discharge manner in the pretreatment phase is high-power continuous discharge, and a plasma discharge manner in the film-coating phase is the high-duty-cycle pulse discharge. During a preparation process for the coating, the movement characteristic of the base material and the high-duty-cycle pulse discharge energy of plasmas form combined linkage. The base material moves during the plasma discharge, so that the deposition efficiency of the coating is increased, and the thickness uniformity and compactness of the coating are improved. The prepared coating has the characteristics of being waterproof and moistureproof, mouldproof, resistant to acidic and basic solvents, resistant to acidic and basic salt mist, and the like.

Description

technical field [0001] The invention belongs to the technical field of plasma chemical vapor deposition, and in particular relates to a method for preparing a multifunctional nano protective coating. Background technique [0002] Corrosive environments are the most common cause of damage to electronic devices. Corrosion of solid materials in electronic devices, reduction of conductor / semiconductor insulation, and failure phenomena such as short circuit, open circuit or poor contact due to environmental corrosion. At present, in the products of high-tech industries such as national defense and aerospace, the proportion of electronic components is increasing, and the requirements for moisture-proof, mildew-proof and corrosion resistance of electronic products are becoming more and more stringent. In the field of communication, with the continuous advancement of technology, the continuous increase of communication frequency, the heat dissipation of communication equipment, and...

AI Technical Summary

Problems solved by technology

[0012] The British P2i company has developed a polymer nano-coating based on a specific small duty cycle pulse discharge method using chemical vapor deposition technology, and its duty ratio is less than 1:1000. The preparation process of the method can not realize the effective coordination and control of the bond length, bond energy, molecular weight of the material and energy supply of different groups in the chemical raw materials, and the scratch resistance and durability of the prepared coating are not ideal.

It is also due to the performance limitation of the coating that the current coating can only form a lyophobic nano-coating on electronic and electrical equipment, and the corrosion resistance caused by the environment cannot be effectively solved.

Moreover, the dense protective coating prepared based on a specific small duty cycle pulse discharge method has a fatal disadvantage: from a microscopic point of view, the small power density in the coating process is not conducive to the formation of a dense structure, and even cannot form a stable film. Structure; from a macro point of view, a small power density is not conducive to the large rate growth of the coating, and the efficiency is low in actual production, which limits its application

[0013] In the existing plasma chemical vapor deposition coating preparation process, the substrate is fixed, and the movement state of the substrate has no correlation with the discharge energy of the plasma; the static substrate in the chamber is treated by the continuous discharge method, The activated chain scission in the monomer is generally combined into a film through simple stacking under the action of continuous discharge, and the resulting coating generally has a loose structure, or even a high degree of powderization, which is not conducive to the formation of a microscopic dense structure of the coating. Therefore, the coating’s Waterproof, moisture-proof, corrosion-resistant, solvent-resistant and other protective properties are poor

[0014] Due to the regional differences in plasma density and chemical raw material density in the reaction chamber, the static substrate will also lead to slow coating deposition in some areas, low production efficiency, and large differences in uniformity and compactness.

Images