A method for preparing multifunctional nano-protective coating by alternating cycle discharge

Abstract

Disclosed is a method for preparing a multi-functional protective nano coating by means of cyclical periodic alternating discharge, which belongs to the technical field of plasma. In the method, a reaction cavity is vacuumized and an inert gas is introduced thereinto; a substrate is made to move in the reaction cavity; monomer vapor is introduced into the reaction cavity; chemical vapor deposition is carried out; the deposition process comprises a preprocessing stage and a film-plating stage, wherein in the preprocessing stage, a plasma discharge mode is high-power continuous discharge, and in the film-plating stage, the plasma discharge mode is periodic alternating discharge; the preprocessing stage and the film-plating stage are cyclically repeated at least once; and during the film-plating process, cyclical introduction is carried out to introduce more active sites on a surface of the substrate, thereby increasing effective film plating, and making a film structure denser. A nano coating of a multi-layered composite structure is obtained, providing multi-layered protection for the product itself. The nano coating exhibits a denser coating structure at the micro level, and exhibits excellent hydrophobicity, adhesion, acid and alkali resistance, mechanical properties, and heat and humidity resistance at the macro level.

Description

technical field [0001] The invention belongs to the technical field of plasma chemical vapor deposition, and in particular relates to a method for preparing a multifunctional nano protective coating. Background technique [0002] Corrosive environments are the most common cause of damage to electronic devices. Corrosion of solid materials in electronic devices, reduction of conductor / semiconductor insulation, and fault phenomena such as short circuit, open circuit or poor contact caused by environmental corrosion. At present, in the products of high-tech industries such as national defense and aerospace, the proportion of electronic components is increasing, and the requirements for moisture-proof, mildew-proof and corrosion resistance of electronic products are becoming more and more stringent. In the field of communication, with the continuous advancement of technology, the continuous increase of communication frequency, the heat dissipation of communication equipment, an...

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Problems solved by technology

[0012] The British P2i company has developed a polymer nano-coating based on a specific small duty cycle pulse discharge method using chemical vapor deposition technology. The duty cycle is less than 1:1000. The preparation process of the method can not realize the effective coordination and control of the bond length, bond energy, molecular weight of the material and energy supply of different groups in the chemical raw materials, and the scratch resistance and durability of the prepared coating are not ideal.

It is also due to the performance limitation of the coating that the current coating can only form a lyophobic nano-coating on electronic and electrical equipment, and the corrosion resistance to the environment cannot be effectively solved.

Moreover, the dense protective coating prepared based on a specific small duty cycle pulse discharge method has a fatal disadvantage: from a microscopic point of view, the small power density in the coating process is not conducive to the formation of a dense structure, and even cannot form a stable film. Structure; from a macro point of view, a small power density is not conducive to the large rate growth of the coating, and the efficiency is low in actual production, which limits its application

[0013] In the existing plasma chemical vapor deposition coating preparation process, the substrate is fixed, and the movement state of the substrate has no correlation with the discharge energy of the plasma; the static substrate in the chamber is treated by the continuous discharge method, The activated chain scission in the monomer is generally combined into a film through simple stacking under the action of continuous discharge, and the resulting coating generally has a loose structure, or even a high degree of powderization, which is not conducive to the formation of a microscopic dense structure of the coating. Therefore, the coating's Waterproof, moisture-proof, corrosion-resistant, solvent-resistant and other protective properties are poor

[0014] Due to the regional differences in plasma density and chemical raw material density in the reaction chamber, the static substrate will also lead to slow coating deposition in some areas, low production efficiency, and there are also large differences in uniformity and compactness.

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