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Application of novel compound 3, 3'-dimethyl(p-biguanide) methane dicyclohexyl in epoxy resin system

A technology of dicyclohexylmethane and epoxy resin system, which is applied in the direction of organic chemistry, can solve the problems of high epoxy resin temperature and poor compatibility of epoxy resin, achieve rapid curing, good heat resistance, and improve toughness good effect

Inactive Publication Date: 2017-10-10
WUHAN INSTITUTE OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, there are many kinds of epoxy resin curing agents on the market with different properties. Dicyandiamide is the most common latent curing agent for epoxy resins. It has good stability and long incubation period. It is a one-component epoxy resin mixed with epoxy resin. The storage period of the resin system is more than half a year, but the compatibility of dicyandiamide and epoxy resin is poor, and the temperature of curing epoxy resin is too high. The actual application exceeds the tolerance range of many devices.

Method used

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  • Application of novel compound 3, 3'-dimethyl(p-biguanide) methane dicyclohexyl in epoxy resin system
  • Application of novel compound 3, 3'-dimethyl(p-biguanide) methane dicyclohexyl in epoxy resin system
  • Application of novel compound 3, 3'-dimethyl(p-biguanide) methane dicyclohexyl in epoxy resin system

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preparation example Construction

[0027] The preparation method of novel curing agent 3,3'-dimethyl (p-biguanide group) dicyclohexylmethane described in the present invention, but not limited to the synthesis method. The synthesis method is as follows: under an inert atmosphere, dicyandiamide and 3,3'-dimethyl-4,4'-diaminodicyclohexylmethane (DMDC) are mixed in a molar ratio of 2:(1~1.5) in a solvent, and react at a constant temperature of 100-120°C for 6-8 hours under acid catalysis, and obtain 3,3'-dimethyl (p-biguanide) dicyclohexylmethane after removal of impurities. More specific steps are as follows:

[0028] (1) feed argon before the reaction to get rid of the air in the reaction system, dicyandiamide, DMDC, hydrochloric acid (37%) are mixed in the solvent water according to the molar ratio of 2:1:3.5, the pH value of the reaction system is controlled at Between 3 and 4, while argon gas is kept flowing, open the condensing reflux device, raise the temperature to 100°C and stir at a constant temperature...

Embodiment 1

[0039] A kind of application method of novel compound 3,3'-dimethyl (p-biguanide group) dicyclohexyl methane in epoxy resin system, its steps are as follows:

[0040] (1) In terms of parts by mass, weigh 100 parts of E51 epoxy resin, 11 parts of 3,3'-dimethyl (p-biguanide) dicyclohexylmethane, stir well, and then place the container containing the mixture in Vibrate in an ultrasonic cleaner, take it out and mix evenly, pour, defoam, and heat to 80°C for 2 hours;

[0041] (2) Post-curing: the product obtained in step (1) was cured at 110° C. for 2 hours to obtain a cured epoxy resin system. The impact strength of the cured epoxy resin system increased by 30.4%, and the toughness increased by 25.8%.

Embodiment 2

[0043] A kind of application method of novel 3,3'-dimethyl (p-biguanide group) dicyclohexyl methane in epoxy resin system, its steps are as follows:

[0044] (1) In terms of parts by mass, weigh 100 parts of E44 epoxy resin, 11 parts of 3,3'-dimethyl (p-biguanide) dicyclohexylmethane, and 2 parts of imidazole accelerator for preparation, and mix the three evenly Finally, hand lay-up molding, curing at room temperature for 5 hours;

[0045] (2) Post-curing: the product obtained in step (1) was cured at 90° C. for 3 hours to obtain a cured epoxy resin system. The impact strength of the cured epoxy resin system increased by 32.5%, and the toughness increased by 26.4%.

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Abstract

The invention discloses an application of using novel compound 3, 3'-dimethyl (p-biguanide) methane dicyclohexyl as novel curing agent in an epoxy resin system. The application method includes steps of using 3, 3'-dimethyl (p-biguanide) methane dicyclohexyl as novel curing agent and adding to the epoxy resin system to mix evenly; shaping, curing and post-curing the curing agent to obtain epoxy resin system condensate. Compared with traditional amine curing agent, the novel curing agent has the advantages of low latency, toxicity and others; the curing temperature is 20-40 DEG C lower than dicyandiamide-epoxy resin system; after introducing a double-loop structure, physical strength of the epoxy resin after curing is enhanced.

Description

technical field [0001] The present invention relates to the application of a novel compound 3,3'-dimethyl (p-biguanide) dicyclohexylmethane in an epoxy resin system. Background technique [0002] At present, there are many kinds of epoxy resin curing agents on the market with different properties. Dicyandiamide is the most common latent curing agent for epoxy resins. It has good stability and long incubation period. It is a one-component epoxy resin mixed with epoxy resin. The storage period of the resin system is more than half a year, but the compatibility of dicyandiamide and epoxy resin is poor, and the temperature of curing epoxy resin is too high, and the actual application exceeds the tolerance range of many devices. Therefore, scientific researchers are looking for a new type of amine epoxy resin curing agent, so that the epoxy resin cured product can meet higher requirements. Contents of the invention [0003] The technical problem to be solved by the present inv...

Claims

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Application Information

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IPC IPC(8): C08G59/50C08L63/00C08K3/26C08K7/14C07C279/26
CPCC08G59/504C07C279/265C08K3/26C08K7/14C08K2003/265C08L2201/08C08L63/00
Inventor 彭永利张雅娇孙勇熊丽君万春杰
Owner WUHAN INSTITUTE OF TECHNOLOGY
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