Methods to improve chamfer area defects in laser cutting process

A technology of laser cutting and regional defects, which is applied in laser welding equipment, welding/cutting media/materials, manufacturing tools, etc., can solve problems such as chamfering irregular shapes and affecting the performance of OLED display panel products, and achieve heat absorption, Reduce the generation of micro-defects and macro-defects, and improve the effect of micro-crack propagation
CN107283075BActive Publication Date: 2019-01-15WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Current Assignee / Owner
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
Publication Date
2019-01-15

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Abstract

The invention provides a method for overcoming chamfering area defects in a laser cutting technology. The method comprises the following steps that a heat conducting buffer layer is formed on the surface of a chambering area of a display panel and comprises a first area and a second area, and the thickness of the portion, in the first area, of the heat conducting buffer layer is smaller than that of the portion, in the second area, of the heat conducting buffer layer; laser is emitted, the laser acts on the first area, the portions, in the first area and the second area, of the heat conducting buffer layer are vaporized, the portion, in the first area, of the heat conducting buffer layer is completely vaporized, the portion, in the second area, of the heat conducting buffer layer is partially vaporized, and thus, the laser acts on the portion, corresponding to the first area, of the display panel; the laser continues to be emitted, the laser keeps cutting the display panel, in the cutting process, the rest portion, in the second area, of the heat conducting buffer layer is melted and flows into a cutting gap, and the heat conducting buffer layer flowing into the cutting gap is vaporized during cutting; and a display panel with an angle of chamfer is formed. The method has the advantages that the undesirable phenomena such as production of heat stress, propagation of micro-cracks, and the like can be effectively avoided.
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Description

technical field

[0001] The invention relates to the field of liquid crystal displays, in particular to a method for improving defects in chamfered areas in a laser cutting process. Background technique

[0002] The flat panel display device has many advantages such as thin body, power saving, and no radiation, and has been widely used. Existing flat panel display devices mainly include liquid crystal display devices (LCD, Liquid Crystal Display) and organic light emitting display devices (OLED, Organic Light Emitting Display).

[0003] Organic light-emitting display devices have the characteristics of self-luminescence, high brightness, wide viewing angle, high contrast, flexibility, and low energy consumption. A new growth point in the display industry, it is widely used in electronic products such as mobile phone screens, computer monitors, and full-color TVs.

[0004] The effect of each process in the OLED display panel manufacturing process will directly affect the sub...

Claims

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