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Preparation method of electric conduction polyimide film

The technology of polyimide film and polyamic acid is applied in the field of preparation of conductive polyimide film, which can solve the problems of circuit board damage, high insulation coefficient of polyimide film, accumulation of static electricity, etc., so as to prevent electrostatic discharge. , excellent electrical conductivity, the effect of enhancing electrical conductivity

Inactive Publication Date: 2017-10-24
ANHUI GUOFENG PLASTIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] With the rapid development of the electronics industry, the integration of electronic circuit boards is getting higher and higher. The ordinary polyimide film has a high insulation coefficient, and it is easy to generate static electricity when it is used for circuit board packaging, which will eventually lead to circuit board damage.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] (1) In a reaction kettle at 15°C, dissolve 20.023g (0.1mol) of 4,4'-diaminodiphenyl ether in 236g of N,N-dimethylformamide (DMF), and then divide it three times Add 20.721g (0.095mol), 0.872g (0.004mol), and 0.044g (0.0002mol) of pyromellitic dianhydride into it and stir for reaction, wherein the interval between two adjacent additions is 15min. After adding the second pyromellitic dianhydride, the stirring reaction was continued for 60 minutes to obtain a polyamic acid solution with a solid content of 15% and a viscosity of 1500 poise.

[0022] (2) Add 0.406 g of superconducting carbon black and 0.021 g of carbon nanotubes to the polyamic acid solution, and disperse them uniformly with a high-shear disperser to obtain a black mixed solution.

[0023] (3) After the mixed solution was subjected to vacuum defoaming treatment, it was coated on a stainless steel plate, and dried in a blast drying oven at 140° C. for 30 minutes. The obtained gel film was peeled off and fixe...

Embodiment 2

[0025] (1) In a reactor at 20°C, dissolve 19.022g (0.095mol) of 4,4'-diaminodiphenyl ether and 0.541g (0.005mol) of p-phenylenediamine in 195g of N,N-bis In methylacetamide (DMAC), 17.231g (0.079mol) of pyromellitic dianhydride, 5.855g (0.0199mol) of 3,3',4,4'-biphenyltetracarboxylic acid di Anhydride, 0.131g (0.0006mol) of pyromellitic dianhydride were added to it and stirred for reaction, wherein the reaction time between two adjacent additions was 20min, and continued after the third addition of pyromellitic dianhydride was completed. The reaction was stirred for 60 minutes to obtain a polyamic acid solution with a solid content of 18% and a viscosity of 2600 poise.

[0026] (2) Add 1.925 g of superconducting carbon black and 0.214 g of carbon nanotubes to the polyamic acid solution, and disperse them uniformly with a high-shear disperser to obtain a black mixed solution.

[0027] (3) After the mixed solution is subjected to vacuum defoaming treatment, it is coated on a st...

Embodiment 3

[0029] (1) In a reactor at 25°C, dissolve 18.021g (0.09mol) of 4,4'-diaminodiphenyl ether and 1.081g (0.01mol) of p-phenylenediamine in 179g of N,N-bis In methylacetamide (DMAC), 10.791g (0.0495mol) of pyromellitic dianhydride, 14.682g (0.0499mol) of 3,3',4,4'-biphenyltetracarboxylic acid di Anhydride, 0.073g (0.0004mol) of pyromellitic dianhydride were added to it and stirred for reaction, wherein the reaction time between two adjacent additions was 30min, and the stirring reaction was continued after the third addition of pyromellitic dianhydride After 60 minutes, a polyamic acid solution with a solid content of 20% and a viscosity of 3500 poise was obtained.

[0030] (2) Add 3.572g of superconducting carbon black and 0.893g of carbon nanotubes to the polyamic acid solution, and disperse them uniformly with a high-shear disperser to obtain a black mixed solution.

[0031] (3) After the mixed solution is subjected to vacuum defoaming treatment, it is coated on a stainless st...

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Abstract

The invention discloses a preparation method of an electric conduction polyimide film. The preparation method comprises: placing an aromatic diamine and an aromatic dianhydride in an aprotic polar solvent according to a molar ratio of 1:0.992-0.998, and carrying out a reaction to obtain a polyamic acid solution; adding carbon-based electric conduction particles to the polyamic acid solution, and uniformly dispersing by using a high shear dispersing machine to obtain a black mixing solution, wherein the carbon-based electric conduction particles account for 1-10 wt% of the total amount of the aromatic diamine and the aromatic dianhydride; coating a stainless steel plate with the mixing solution, drying, and stripping to obtain a gel film; and fixing the periphery of the gel film on a metal frame, placing in an imidization furnace, and carrying out imidization to obtain the electric conduction polyimide film. According to the present invention, the prepared electric conduction polyimide film has the volume resistivity of 10<3>-10<8>omega.cm, has the surface resistivity of 10<4>-10<8>omega.cm<2>, and further has performances of high strength, high modulus and the like.

Description

technical field [0001] The invention relates to the technical field of film preparation, in particular to a preparation method of a conductive polyimide film. Background technique [0002] Polyimide film has been widely used in aviation, aerospace, electronics and other fields due to its excellent heat resistance, high mechanical strength, high dimensional stability and radiation resistance. In the field of microelectronics, polyimide films are widely used as packaging materials for flexible circuit boards. [0003] With the rapid development of the electronics industry, the integration of electronic circuit boards is getting higher and higher. The ordinary polyimide film has a high insulation coefficient, and it is easy to generate static electricity when it is used for circuit board packaging, which will eventually lead to damage to the circuit board. When an organization in the United States tested the integrated circuits in a large-scale communication system equipment, ...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08K3/04C08K7/24C08J5/18C08G73/10
CPCC08G73/1071C08G73/1007C08G73/1042C08J5/18C08J2379/08C08K3/04C08K7/24C08K2201/001C08K2201/011C08L2201/04C08L2203/16C08L79/08
Inventor 史恩台陈铸红孙善卫吴天华
Owner ANHUI GUOFENG PLASTIC
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