Chip support assembly, reaction cavity chamber and semiconductor processing equipment

Abstract

The invention provides a chip support assembly, a reaction cavity chamber and semiconductor processing equipment. The chip support assembly comprises a tray and a substrate, wherein the tray is used for bearing a plurality of chips, the substrate is used for bearing the tray and can be raised and descended so that the substrate is raised to a process position for performing the process or is descended to a disassembly position to do operation of taking and placing the tray, a plurality of hollow parts are arranged on the tray, each chip is in one-to-one corresponding to each hollow part, each hollow part is used for allowing the tray only to be contact with an edge region of a lower surface of each chip, a plurality of bosses are arranged on an upper surface of the substrate, and when the substrate is arranged at the process position, each boss is arranged in each hollow part in one-to-one correspondence and the chips are supported. With the chip support assembly provided by the invention, the problem that the edges of the lower surfaces of the chips are polluted during preclean of the chips can be prevented, moreover, the heating or cooling efficiency also can be improved, so that the yield can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer support assembly, a reaction chamber and semiconductor processing equipment. Background technique [0002] Semiconductor processing equipment is a common equipment for processing semiconductor devices. During processes such as etching, sputtering and chemical vapor deposition, in order to improve the quality of products, the wafer must first be pre-cleaned (Preclean) before the deposition process. ) to remove impurities such as oxides on the wafer surface. The basic principle of a general pre-cleaning chamber is to excite the cleaning gas such as argon, helium or hydrogen that is passed into the cleaning chamber to form a plasma to chemically react and physically bombard the wafer, so that the surface of the wafer can be removed. of impurities. [0003] In addition, during the process, chucks are generally used to support and fix workpieces to be pro...

AI Technical Summary

Problems solved by technology

[0008] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a wafer support assembly, a reaction chamber, and semiconductor processing equipment, which can not only prevent the edge of the lower surface of the wafer from being damaged when the wafer is pre-cleaned. Contamination issues, but also can improve heating or cooling efficiency, which can increase production capacity

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