Chip support assembly, reaction cavity chamber and semiconductor processing equipment

A technology for supporting components and reaction chambers, used in semiconductor/solid-state device manufacturing, electrical components, metal material coating processes, etc., can solve problems such as pollution, and achieve the effect of increasing production capacity and improving heating or cooling efficiency

Active Publication Date: 2017-10-31
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0008] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a wafer support assembly, a reaction chamber, and semiconductor processing equipment, which can no

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  • Chip support assembly, reaction cavity chamber and semiconductor processing equipment
  • Chip support assembly, reaction cavity chamber and semiconductor processing equipment
  • Chip support assembly, reaction cavity chamber and semiconductor processing equipment

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[0030] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the wafer support assembly, reaction chamber and semiconductor processing equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0031] Figure 4 It is a schematic structural diagram of a tray in a wafer support assembly provided by an embodiment of the present invention. Figure 5 It is a schematic structural diagram of a base in a wafer support assembly provided by an embodiment of the present invention. Image 6 This is a partial cross-sectional view of a wafer support assembly provided by an embodiment of the present invention. Please refer to Figure 4-Figure 6 , The wafer support assembly includes a tray 11 and a base 14. The tray 11 is used to carry a plurality of wafers 16, and a plurality of hollow parts are provided on the tray 11, and each wafer is located at each hollow part in a ...

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Abstract

The invention provides a chip support assembly, a reaction cavity chamber and semiconductor processing equipment. The chip support assembly comprises a tray and a substrate, wherein the tray is used for bearing a plurality of chips, the substrate is used for bearing the tray and can be raised and descended so that the substrate is raised to a process position for performing the process or is descended to a disassembly position to do operation of taking and placing the tray, a plurality of hollow parts are arranged on the tray, each chip is in one-to-one corresponding to each hollow part, each hollow part is used for allowing the tray only to be contact with an edge region of a lower surface of each chip, a plurality of bosses are arranged on an upper surface of the substrate, and when the substrate is arranged at the process position, each boss is arranged in each hollow part in one-to-one correspondence and the chips are supported. With the chip support assembly provided by the invention, the problem that the edges of the lower surfaces of the chips are polluted during preclean of the chips can be prevented, moreover, the heating or cooling efficiency also can be improved, so that the yield can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer support assembly, a reaction chamber and semiconductor processing equipment. Background technique [0002] Semiconductor processing equipment is a common equipment for processing semiconductor devices. During processes such as etching, sputtering and chemical vapor deposition, in order to improve the quality of products, the wafer must first be pre-cleaned (Preclean) before the deposition process. ) to remove impurities such as oxides on the wafer surface. The basic principle of a general pre-cleaning chamber is to excite the cleaning gas such as argon, helium or hydrogen that is passed into the cleaning chamber to form a plasma to chemically react and physically bombard the wafer, so that the surface of the wafer can be removed. of impurities. [0003] In addition, during the process, chucks are generally used to support and fix workpieces to be pro...

Claims

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Application Information

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IPC IPC(8): H01L21/673H01L21/687H01L21/67C23C14/50C23C14/02
CPCC23C14/022C23C14/50H01L21/67011H01L21/67313H01L21/68714H01L21/68771
Inventor 李冬冬
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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