Technology for manufacturing ultra-micro semiconductor cooling device

Abstract

The invention discloses a technology for manufacturing an ultra-micro semiconductor cooling device. The technology here involves the following steps: S1. bonding a wafer which is applied with a metal coating to a blue film, cutting the wafer into crystal particles, and expanding the blue film and the crystal particles which are bonded to the blue film by using an expander, and displacing the one lateral side of the expanded blue film back from the crystal particles to a die; S2. suctioning the crystal particles on the die which are obtained from S1 by using a suction head on a chip sorter, and placing the crystal particles to a ceramic chip designated position; S3. placing the ceramic chip which is obtained from S2 to a heating platform of a rework station, and bonding and pressing another ceramic chip with the ceramic chip which is obtained from S2, performing heating and welding after starting the heating platform, performing cooling after welding, wherein since the crystal particles are arranged by using automatic suction and placement of the chip sorter, and the upper and lower ceramic chips are aligned by using an optical alignment system of the rework station, the technology can achieve the alignment of the upper and lower ceramic chips, has high efficiency and is more accurate to operate.

Description

technical field [0001] The invention relates to the field of semiconductor refrigeration devices, in particular to a manufacturing process of ultra-miniature semiconductor refrigeration devices. Background technique [0002] The working principle of the semiconductor refrigeration device is based on the Peltier principle, that is, when a circuit composed of an N-shaped semiconductor and a P-shaped semiconductor is connected to a direct current, some other heat will be released at the joint in addition to Joule heat. The other joint absorbs heat. Existing semiconductor refrigeration devices generally include porcelain plates and semiconductor crystal grains. The semiconductor grains are welded on the porcelain plate. The porcelain plate plays the role of electrical insulation, heat conduction and support. The main functional part of the cold component, the crystal grain is soldered to the metallization layer of the porcelain plate by soldering. [0003] For conventional sem...

AI Technical Summary

Problems solved by technology

Therefore, due to the above-mentioned characteristics of the ultra-miniature semiconductor refrigeration device itself, the manufacturing process of the existing conventional semiconductor refrigeration device cannot meet the requirements for the production of the ultra-miniature semiconductor refrigeration device.

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