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De-molding composition for semiconductor encapsulating, application of de-molding composition and preparation method for semiconductor encapsulating material

A technology for semiconductors and compositions, applied in the field of mold release compositions for semiconductor packaging, can solve problems such as affecting the speed and amount of release agents migrating to the mold surface, affecting the production process and product quality, and affecting the consistency of product appearance. , to achieve good reusability, improve coating uniformity and production efficiency, and good mold release effect.

Inactive Publication Date: 2017-12-08
东莞市浦元电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the phenomenon of uneven spraying of the release agent, it often affects the consistency of product appearance
At the same time, due to the compatibility of the rubber carrier and the release agent system, the speed and amount of migration of the release agent to the mold surface will be affected. In addition, the curing time of the release adhesive is 300 to 600 seconds per mold, and the operating time Long, in the process of use, there will be problems such as the release glue body remaining in the mold cavity, which will also affect the production process and product quality

Method used

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  • De-molding composition for semiconductor encapsulating, application of de-molding composition and preparation method for semiconductor encapsulating material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] With a density of 500g / dm 3 , the pore size is 300μm, the resilience is greater than 80%, the elongation at break is greater than 300%, and the tear strength is greater than 1.8N / mm 2 , the compressive strength is greater than 7KPa, and the polyurethane sponge with elongation strength greater than 300KPa is used as the carrier, and the long-chain alkyl modified silicone oil is used as the release agent;

[0048] Then, a release agent with 20% of the mass of the carrier was adsorbed in the carrier, which was the release composition for semiconductor encapsulation of Example 1.

Embodiment 2

[0050] With a density of 500g / dm 3 , the pore size is 300μm, the resilience is greater than 80%, the elongation at break is greater than 300%, and the tear strength is greater than 1.8N / mm 2 , the compressive strength is greater than 7KPa, and the polyurethane sponge with elongation strength greater than 300KPa is used as the carrier, and the mercapto-modified silicone oil is used as the release agent;

[0051] Then, a release agent with 20% of the mass of the carrier was adsorbed in the carrier, which was the release composition for semiconductor encapsulation of Example 2.

Embodiment 3

[0053] With a density of 500g / dm 3 , the pore size is 300μm, the resilience is greater than 80%, the elongation at break is greater than 300%, and the tear strength is greater than 1.8N / mm 2 , a polyurethane sponge with a compressive strength greater than 7KPa and an elongation strength greater than 300KPa as the carrier, and long-chain alkyl modified silicone oil and polyether modified polyorganosiloxane as the release agent;

[0054] Wherein, in the release agent of Example 3, the mass percentage of the long-chain alkyl modified silicone oil is 80%, and the mass percentage of the polyether-modified polyorganosiloxane is 20%;

[0055] Then, a release agent with 20% of the mass of the carrier was adsorbed in the carrier, which was the release composition for semiconductor encapsulation of Example 3.

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Abstract

The invention provides a de-molding composition for semiconductor encapsulating, application of the de-molding composition and a preparation method for the semiconductor encapsulating material. The de-molding composition for semiconductor encapsulating takes polyurethane sponge as a carrier material, the carrier has good lipophilicity and proper mould release agent accommodating amount and spreadability, and can realize uniformity of mould release agent coating. Meanwhile, the de-molding composition for semiconductor encapsulating provided by the invention is short in coating time, is free of carrier residues on the mould surface, and can effectively improve production efficiency. Meanwhile, the de-molding composition for semiconductor encapsulating has excellent practical performance, and is suitable for being used as a mould release agent to replace other de-molding products in a semiconductor encapsulating process, and improves production efficiency while achieving the good de-molding effect.

Description

technical field [0001] The invention relates to the field of materials for semiconductor packaging, in particular to a release composition for semiconductor packaging, its application and a preparation method of the material for semiconductor packaging. Background technique [0002] In order to isolate and protect semiconductor chips from external environments such as gas, pollutants, light, magnetism, high-frequency waves, and shocks, so as to make their performance more stable and reliable, semiconductor chips are usually packaged and protected with resin and other materials. [0003] The more common encapsulation method is to form the encapsulation of the semiconductor through the transfer method, that is, after heating and melting thermosetting resin such as epoxy resin, transfer and fill it into the mold with the semiconductor installed, and make it solidify and form. In order to ensure the smooth detachment of the molded semiconductor package from the mold, a release a...

Claims

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Application Information

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IPC IPC(8): B29C33/62
CPCB29C33/62
Inventor 吕佩卓张进
Owner 东莞市浦元电子有限公司