Multilayer structure copper-zinc-sulfur (CZTS) film solar energy battery back electrode and preparation method for the same
A technology of solar cells and copper-zinc-tin-sulfur, which is applied in the field of solar cells, can solve the problems of increasing short-circuit current, poor conductivity, and insignificant improvement of the performance of CZTS thin-film solar cells, and achieves the effect of inhibiting reaction and improving stability.
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Embodiment 1
[0025] 1μm Mo / 10nm Au / 10nm MoS 2 Preparation of structured back electrodes:
[0026] 1. Place the 1 μm Mo base glass on the chamber substrate for magnetron sputtering deposition, vacuumize to 0.3Pa, turn on the power supply I of the sputtering inert metal Au source, set the sputtering power to 100W, and after glow discharge, Open baffle, start sputtering, close power supply 1 and baffle after sputtering time 10s, finish the deposition of 10nm Au inert metal layer;
[0027] 2. After the deposition of the 10nm Au inert metal layer is completed, clean the chamber with Ar gas, evacuate to 0.1Pa again, turn on the power supply II for sputtering Mo, set the sputtering power to 180W, and turn off the power supply II and the shield after 10s of sputtering time. plate, complete the deposition of 10nm Mo layer;
[0028] 3. Put the composite substrate deposited with a certain thickness of Au and Mo in a vulcanization tube, heat up to 600°C at a rate of 50°C / s, control the pressure of t...
Embodiment 2
[0033] 1.5μm Mo / 50nm Pt / 50nm MoS 2 Preparation of structured back electrodes:
[0034] 1. Place the 1.5 μm Mo substrate glass on the cavity substrate for magnetron sputtering deposition, evacuate to 0.1Pa, turn on the power supply I of the sputtering inert metal Pt source, set the sputtering power to 150W, and after glow discharge , open the baffle, start sputtering, close the power supply 1 and the baffle after the sputtering time 20s, and finish the deposition of the 50nm Pt inert metal layer.
[0035] 2. After completing the deposition of the 50nm Pt inert metal layer, use Ar gas to clean the chamber, evacuate to 2Pa again, turn on the power supply II for sputtering Mo, set the sputtering power to 30W, and turn off the power supply II and the baffle after the sputtering time is 100s , to complete the deposition of a 50nm Mo layer.
[0036] 3. Place the composite substrate deposited with a certain thickness of Pt and Mo in a vulcanization tube, raise the temperature to 300...
Embodiment 3
[0041] 2μm Mo / 500nm Pd / 25nm MoS 2 Preparation of structured back electrodes:
[0042] 1. Place the 2 μm Mo substrate glass on the cavity substrate for magnetron sputtering deposition, evacuate to 5Pa, turn on the power supply I of the sputtering inert metal Pd source, set the sputtering power to 50W, and after glow discharge, turn on Baffle plate, start sputtering, close power source I and baffle plate after sputtering time 120s, finish the deposition of 500nm Pd inert metal layer;
[0043] 2. After completing the deposition of the 500nm Pd inert metal layer, clean the cavity with Ar gas, evacuate to 5Pa again, turn on the power supply II for sputtering Mo, set the sputtering power to 35W, and turn off the power supply II and the baffle after the sputtering time is 40s , complete the deposition of 25nm Mo layer;
[0044] 3. Put the composite substrate deposited with a certain thickness of Pd and Mo in a vulcanization tube, raise the temperature to 250°C at a rate of 100°C / s,...
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