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Single-component insulating structured adhesive with high thermal conductivity and preparation method of single-component insulating structured adhesive

A technology of insulating structure and thermally conductive insulating filler, applied in the direction of adhesives, adhesive additives, polymer adhesive additives, etc., can solve the problems of poor thermal conductivity, high viscosity of structural adhesives, poor fluidity, etc., and achieve good temperature resistance , low thermal expansion coefficient and low cost

Inactive Publication Date: 2017-12-15
YANTAI SEAYU NEW MATERIALS CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a single-component high thermal conductivity insulating structural adhesive and its preparation method. The present invention solves the problems of high structural adhesive viscosity, poor fluidity and poor thermal conductivity

Method used

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  • Single-component insulating structured adhesive with high thermal conductivity and preparation method of single-component insulating structured adhesive

Examples

Experimental program
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Effect test

Embodiment 1

[0035] 10 parts of 3,4-epoxycyclohexyl carboxylate, 5 parts of bisphenol A epoxy resin, 10 parts of modified epoxy resin, core-shell toughening agent Kane Ace@MX-125: 3 parts, epoxypropylene Add 1 part of oxytrimethoxysilane to the dual planetary dynamic mixing kettle in turn, turn on revolution stirring and high-speed dispersion, stir for 1 hour at a temperature of 25°C, add 62.5 parts of modified thermally conductive insulating filler, stir for 1 hour, add double 8 parts of cyanamide, stirred for 1 hour, added 0.5 parts of fumed silicon dioxide, stirred for 1 hour, turned on the vacuum pump to evacuate for 1 hour, and the vacuum pressure was -0.098 to obtain a single-component high thermal conductivity insulating structural adhesive; the revolution stirring speed is 20r / min, high-speed dispersion speed is 800r / min;

[0036] Described modified epoxy resin is carried out according to the following steps:

[0037] Add 125g of hydroquinone and 25g of 4,4-dihydroxybiphenyl into ...

Embodiment 2

[0051] 10 parts of 3,4-epoxycyclohexyl carboxylate, 5 parts of bisphenol A epoxy resin, 20 parts of modified epoxy resin, core-shell toughening agent Kane Ace@MX-125: 3 parts, epoxypropylene Add 1 part of oxytrimethoxysilane to the dual planetary dynamic mixing kettle in turn, turn on revolution stirring and high-speed dispersion, stir for 1 hour at a temperature of 25°C, add 52.5 parts of modified thermally conductive insulating filler, stir for 1 hour, add double 8 parts of cyanamide, stirred for 1 hour, added 0.5 parts of fumed silicon dioxide, stirred for 1 hour, turned on the vacuum pump to evacuate for 1 hour, and the vacuum pressure was -0.098 to obtain a single-component high thermal conductivity insulating structural adhesive; the revolution stirring speed is 20r / min, high-speed dispersion speed is 800r / min;

[0052] Described modified epoxy resin is carried out according to the following steps:

[0053] Add 125g of hydroquinone and 25g of 4,4-dihydroxybiphenyl into ...

Embodiment 3

[0067] 10 parts of 3,4-epoxycyclohexyl carboxylate, 5 parts of bisphenol A epoxy resin, 15 parts of modified epoxy resin, core-shell toughening agent Kane Ace@MX-125: 3 parts, epoxypropylene Add 1 part of oxytrimethoxysilane to the dual planetary dynamic mixing kettle in turn, turn on revolution stirring and high-speed dispersion, stir for 1 hour at a temperature of 25°C, add 57.5 parts of modified thermally conductive insulating filler, stir for 1 hour, add double 8 parts of cyanamide, stirred for 1 hour, added 0.5 parts of fumed silicon dioxide, stirred for 1 hour, turned on the vacuum pump to evacuate for 1 hour, and the vacuum pressure was -0.098 to obtain a single-component high thermal conductivity insulating structural adhesive; the revolution stirring speed is 20r / min, high-speed dispersion speed is 800r / min;

[0068] Described modified epoxy resin is carried out according to the following steps:

[0069] Add 125g of hydroquinone and 25g of 4,4-dihydroxybiphenyl into ...

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Abstract

The invention relates to a single-component insulating structured adhesive with high thermal conductivity and a preparation method of the single-component insulating structured adhesive. Epoxy resin, modified epoxy resin, a toughening agent and a coupling agent are sequentially added to a double-planet power mixing kettle in sequence, revolution stirring and high-speed dispersing are started, and the components are stirred for 1 h at certain temperature; modified thermally conductive and insulating packing is added, and stirring is performed for 1 h; a latent curing agent is added, and stirring is performed for 1 h; fumed silica is added, stirring is performed for 1 h, a product is kept at certain pressure for 1 h, and the single-component insulating structured adhesive with high thermal conductivity is obtained. The single-component insulating structured adhesive with high thermal conductivity has the characteristics of being low in viscosity, good in flowability, resistant to high temperature and excellent in thermal conductivity.

Description

technical field [0001] The invention relates to a single-component high thermal conductivity insulating structural adhesive and a preparation method thereof. Background technique [0002] At this stage, in the motor industry, with the development of science and technology, the requirements are getting higher and higher, and the running time of the motor is required to be longer and longer, and the operation of the motor generates a lot of heat, so the temperature resistance of the motor is required to be higher and higher. The glue protecting the motor coil has poor temperature resistance and is brittle, which can easily cause the glue to crack and the coil to break. Therefore, the temperature resistance, flexibility and impact resistance of glue restrict the development of this industry. In order to improve the temperature resistance and flexibility of the adhesive system, expensive raw materials are often selected, resulting in an increase in production costs. [0003] I...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/08C08G59/06
CPCC09J163/00C08G59/063C08K2003/2227C08K2201/003C08L2201/08C08L2205/025C08L2205/035C08L2207/53C09J11/04C09J11/08C08L63/00C08K9/04C08K3/22
Inventor 李娜李峰贺国新张利文
Owner YANTAI SEAYU NEW MATERIALS CORP LTD
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