Encapsulating resin composition and electronic component device

A technology for a resin composition and electronic components, applied in the fields of electronic component devices and resin compositions for sealing, can solve problems such as insufficient high-temperature storage characteristics, and achieve the effects of excellent high-temperature storage characteristics, sufficient adhesion, and sufficient adhesion.

Inactive Publication Date: 2018-01-02
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, electronic component devices with copper wires sometimes have insufficient high-temperature storage characteristics.

Method used

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  • Encapsulating resin composition and electronic component device
  • Encapsulating resin composition and electronic component device
  • Encapsulating resin composition and electronic component device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0184] Mix epoxy resin 1 (8.7 parts by mass), phenolic resin curing agent 1 (6.4 parts by mass), inorganic filler 1 (73.72 parts by mass), inorganic filler 2 (10 parts by mass) and compound 1 using a mixer at room temperature. (0.03 parts by mass), coupling agent 1 (0.2 parts by mass), curing accelerator 1 (0.25 parts by mass), colorant (0.4 parts by mass), ion scavenger (0.1 parts by mass) and release agent (0.2 parts by mass ) mixing, followed by roll kneading at 70-100°C. Next, after cooling, it pulverized, and the resin composition for sealing of Example 1 was obtained.

Embodiment 2～8、 comparative example 1～2

[0186] Except having shown the usage-amount (compounding quantity) of each component in Table 1, it carried out similarly to Example 1, and each sealing resin composition of Examples 2-8 and Comparative Examples 1-2 was obtained.

[0187] [Manufacture of semiconductor devices (electronic component devices)]

[0188] Mount the TEG (Test Element Group) chip (3.5mm×3.5mm) on a 352-pin BGA (the substrate is a bismaleimide-triazine resin / glass cloth substrate with a thickness of 0.56mm, and the package size is 30mm×30mm, thickness 1.17mm). Next, using a copper wire (copper purity: 99.99% by mass, diameter: 25 μm), wire bonding was performed on the electrode pads with a wire pitch of 80 μm.

[0189] Using a low-pressure transfer molding machine ("Y series" manufactured by TOWA), the obtained sealing resin compositions of Examples and Comparative Examples were used under the conditions of a mold temperature of 175°C, an injection pressure of 6.9MPa, and a curing time of 2 minutes. ...

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Abstract

This encapsulating resin composition comprises an epoxy resin (A), a hardener (B), an inorganic filler (C), and a compound (D) represented by the following formula (1). In formula (1), R1 is a polar group or a hydrocarbon group. This electronic component device (10) comprises an electronic component (11) and an encapsulation material (12) with which the electronic component (11) has been encapsulated, the encapsulation material (12) being a cured object obtained from the encapsulating resin composition.

Description

technical field [0001] The present invention relates to a sealing resin composition and an electronic component device using the sealing resin composition. Background technique [0002] Electronic components such as diodes, transistors, and integrated circuits are distributed on the market or incorporated in electronic equipment as electronic component devices sealed with cured products such as epoxy resin compositions. The epoxy resin composition used in this sealing material generally includes components such as epoxy resin, phenolic resin-based curing agent, inorganic filler, and coupling agent. In addition, with recent trends such as miniaturization, weight reduction, and high performance of electronic equipment, and the development of high integration of electronic components, the performance required for sealing materials (resin compositions for sealing) has also increased. Specific properties required for sealing materials include, for example, adhesiveness, solder r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00H01L23/29H01L23/31
CPCC08L63/00H01L23/295H01L23/3121H01L24/32H01L24/45H01L24/48H01L24/73H01L2224/32245H01L2224/45144H01L2224/45147H01L2224/48091H01L2224/48247H01L2224/73265H01L2924/181C08G59/686C09K3/1006H01L2924/00014H01L2924/00012H01L2924/01204C08K3/34C08K5/20C08K5/09C08K5/132C08K5/49C08K5/548H01L24/42C08K5/08C08K5/3415C08K5/50C08K5/5403C09J11/06C09J163/00
Inventor 中尾优黑田洋史
Owner SUMITOMO BAKELITE CO LTD
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