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High-speed, high-efficiency sic power modules

A power converter and conductive layer technology, applied in the field of high-frequency power converter modules, can solve the problems of large filter components and high power converter system cost, etc.

Active Publication Date: 2020-09-11
沃孚半导体公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As such, filtering components used with power converter circuits utilizing silicon (Si) switching components must be relatively large, driving up the cost of the power converter system

Method used

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  • High-speed, high-efficiency sic power modules
  • High-speed, high-efficiency sic power modules
  • High-speed, high-efficiency sic power modules

Examples

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Embodiment Construction

[0019] The embodiments presented below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best way to practice the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and recognize applications of these concepts not particularly emphasized herein. It is to be understood that these concepts and applications are within the scope of this disclosure and the appended claims.

[0020] It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure...

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Abstract

A power converter module includes an active metal braze (AMB) substrate, a power converter circuit, and a housing. The AMB substrate includes an aluminum nitride based layer, a first conductive layer on a first surface of the aluminum nitride based layer, and a second conductive layer on a second surface of the aluminum nitride based layer opposite to the first surface. The power converter circuit includes a plurality of silicon carbide switching components coupled to each other via a first conductive layer. An enclosure is disposed over the power converter circuitry and the AMB substrate. By using an AMB substrate with an aluminum nitride base layer, the heat dissipation of the power converter module can be significantly improved while maintaining the structural integrity of the power converter module.

Description

technical field [0001] The present disclosure relates to power converter modules, and in particular to high frequency power converter modules utilizing silicon carbide (SiC) components. Background technique [0002] A power converter module (referred to herein as a power converter module may also include a power inverter module) is an independent device that can perform various functions within a power converter system. For example, a power converter module may include a boost converter, a buck converter, a half-bridge converter, and a full-bridge converter. Conventional power converter modules typically include power converter circuitry utilizing silicon (Si) switching components. While effective, in many applications, the use of power converter circuits with silicon (Si) switching components typically limits the switching frequency at which the power converter circuit can operate. The lower the switching frequency of components within the power converter circuit, the gre...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/373H01L25/07H01L29/16
CPCH01L23/3735H01L23/4951H01L23/49541H01L23/49565H01L23/49838H01L23/49816H02M1/08H02M7/003H02M3/155H05K3/303H02M1/44H01L25/072H02M1/0054H02M1/348B60L2210/00H01L2224/49111H01L2224/4903H01L2224/49431H01L2224/0603Y02B70/10H01L2924/00014H01L2224/45015H01L2224/45099H01L2924/2076H02M3/003H01L29/1608
Inventor 姆里纳尔·K·达斯亚当·巴克利亨利·林马塞洛·舒普巴赫
Owner 沃孚半导体公司