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Conductive mask and conductive mask set for selective electroplating rfid antenna gold plating layer

A selective, gold-plated layer technology, applied in the field of microelectronics, can solve the problems of increasing production costs, complicated procedures, etc., and achieve the effect of accurate control and the same current density

Active Publication Date: 2019-10-22
群茂国际贸易(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] These two commonly used methods not only increase the production cost, but also the process is more complicated

Method used

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  • Conductive mask and conductive mask set for selective electroplating rfid antenna gold plating layer
  • Conductive mask and conductive mask set for selective electroplating rfid antenna gold plating layer
  • Conductive mask and conductive mask set for selective electroplating rfid antenna gold plating layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A conductive mask for selectively electroplating a gold-plated layer of an RFID antenna according to the present invention comprises a hollow cylindrical and rotatable conductive roller 11 filled with electroplating solution. The outer peripheral surface of the conductive roller 11 is the functional surface 3 that can be in surface contact with the strip 8 and the RFID antenna 9 on the strip 8 .

[0038] The functional surface 3 is provided with a protruding tooth 39 that can engage with the tooth hole 81 on the strip 8 , and the conductive roller 11 drives the strip 8 to move synchronously along its outer circumferential surface. At the same time, although the functional surface 3 is an arc surface, it can also be attached to the strip 8 and the RFID antenna 9 on the strip 8 . The conductive roller 11 is therefore especially suitable for flexible strips with a thickness of 165 μm.

[0039] The functional surface 3 has a near-end electroplating window 31 for electropla...

Embodiment 2

[0045] A conductive mask for selectively electroplating a gold-plated layer of an RFID antenna according to the present invention includes a mask body 21, and the bottom surface of the mask body 21 is a functional surface 3 that can be in contact with the strip 8 and the RFID antenna 9 on the strip 8 . The top end of the mask body 21 is connected with a reciprocating motion control device 22 for controlling the reciprocating motion of the mask body 21 . The bottom surface of the mask body 21 is the functional surface 3 .

[0046] The functional surface 3 is provided with a convex tooth 39 that engages with the tooth hole 81 on the strip 8, and the reciprocating motion control device 22 makes the mask body 21 engage with the tooth hole 81 on the strip 8 through the convex tooth 39, and then the strip 8 is transferred to the electroplating solution, so that the electroplating solution electroplates the near-end pad 91 and the far-end pad 92 of the RFID antenna 9. After the elec...

Embodiment 3

[0051] Embodiment 3 is a corresponding improvement on the basis of Embodiment 1, that is, a selective plating window 33 is provided on the functional surface 3 of the conductive roller 11 for electroplating a gold plating layer on the selective plating area 94 of the RFID antenna 9 . Under the premise of ensuring the effective width of the functional surface 3, the shape of the selective electroplating window 33 can be arbitrary, and the selective electroplating window 33 can communicate with the far-end electroplating window 32 or include the far-end electroplating window 32, or can It is independent from the electroplating window 32 at the far end.

[0052] The purpose of such design is: RFID antenna 9 is not plated gold-plated layer by the part covered by described conductive mask machine, and near-end pad 91 and far-end pad 92, and designate electroplating area 94, correspondingly pass through The end electroplating window 31, the far-end electroplating window 32 and the s...

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Abstract

The invention discloses a conductive mask for selectively electroplating RFID antennas with gold plating layers and belongs to the field of microelectronics. The conductive mask is capable of drivingstrips carrying the RFID antennas to move synchronously. The conductive mask is provided with a functional surface capable of being in surface contact with the strips and the RFID antennas on the strips, wherein the functional surface is conductive. The functional surface is provided with near-end electroplating windows for conducting electroplating on near-end pressure welding points of the RFIDantennas on the strips and far-end electroplating windows for conducting electroplating on far-end pressure welding points of the RFID antennas on the strips. The conductive mask has the technical effects that in the electroplating process, the near-end pressure welding points and the far-end pressure welding points of the RFID antennas are similar in potential and are the same in current density,and it is guaranteed that the thickness of the gold plating layers of the near-end pressure welding points and the thickness of the gold plating layers of the far-end pressure welding points of the RFID antennas are basically the same. The invention discloses a conductive mask set for selectively electroplating the RFID antennas with the gold plating layers and belongs to the field of microelectronics.

Description

technical field [0001] The invention relates to a conductive mask and a conductive mask group for selectively electroplating a gold-plated layer of an RFID antenna in the field of microelectronics. Background technique [0002] The RFID smart label on the strip 8 of the smart card module is mainly composed of a chip and an RFID antenna 9 . The important process is to interconnect the near-end pads 91 and far-end pads 92 of the RFID antenna 9 with the corresponding pads on the chip, interconnect and weld them with gold wires, and finally package them into RFID products with UV glue. After the RFID antenna 9 on the strip 8 is etched, a gold-plated layer with an appropriate thickness needs to be electroplated. Elements that can be used for the gold-plated layer include Au, Pd, Ni, Ag, and the like. To ensure that the thickness of the gold-plated layer of the near-end pad 91 and the far-end pad 92 of the RFID antenna 9 meets the requirements of gold wire ball bonding. [0003]...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/02C25D7/00C25D3/48H01Q1/22H01Q1/38
Inventor 周宗涛王子宏
Owner 群茂国际贸易(上海)有限公司