Gluing process of finger joint plate
A gluing process and finger-jointed board technology, which is applied in the direction of adhesives, wooden veneer joints, monocarboxylate copolymer adhesives, etc., to achieve the effect of improving the overall quality and reducing the amount of sizing
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Embodiment 1
[0019] A gluing process for finger-jointed boards, the formaldehyde-free finger-jointed board is when the finger-joined wood chips are finger-joined to 1 / 3 of the state, applying high pressure to the gap between the cooperating saw teeth and grooves of the finger-joined wood chips The adhesive is sprayed and bonded under hot pressing or cold pressing. The viscosity of the adhesive is 5mPa·s, and the adhesive includes the following raw materials in parts by weight: base material: curing agent : curing accelerator: filler: auxiliary material = 1:0.02:0.01:0.04:0.01.
[0020] The base material includes melamine-modified urea-formaldehyde resin, silicone resin, unsaturated polyester, polyvinyl acetate and polyvinyl alcohol.
[0021] The curing agent includes diethylenetriamine and xylylenediamine.
[0022] The curing accelerator is an epoxy resin curing accelerator.
[0023] The filler is wood flour, oxidized starch, and phenolized lignin, and the size of the wood flour should b...
Embodiment 2
[0026] A gluing process for finger-jointed boards, the formaldehyde-free finger-jointed board is when the finger-joined wood chips are finger-joined to 2 / 5, the gap between the cooperating saw teeth and grooves of the finger-joined wood chips is pressed under high pressure The adhesive is sprayed and bonded under hot pressing or cold pressing. The viscosity of the adhesive is 6mPa·s. The adhesive includes the following raw materials in parts by weight: base material: curing agent : curing accelerator: filler: auxiliary material = 1:0.04:0.02:0.05:0.015.
[0027] The base material includes phenolic resin, silicone resin, unsaturated polyester and perchlorethylene.
[0028] The curing agent includes m-phenylenediamine and 120 curing agent.
[0029] The curing accelerator is an epoxy resin curing accelerator.
[0030] The filler is wood powder, oxidized starch, phenolized lignin, zinc oxide powder, kaolin powder, and the size of the wood powder should be such that it can pass t...
Embodiment 3
[0033] A gluing process for finger-jointed boards, the formaldehyde-free finger-jointed board is when the finger-joined wood chips are finger-joined to 1 / 2, the gap between the cooperating saw teeth and grooves of the finger-joined wood chips is pressed under high pressure The adhesive is sprayed and bonded under hot pressing or cold pressing. The viscosity of the adhesive is 7mPa·s. The adhesive includes the following raw materials in parts by weight: base material: curing agent : curing accelerator: filler: auxiliary material = 1:0.06:0.015:0.06:0.02.
[0034] The base material includes melamine-modified urea-formaldehyde resin, epoxy resin, phenolic resin, organic silicon resin, unsaturated polyester, polyvinyl acetate, polyvinyl alcohol, perchlorethylene and polyisobutylene.
[0035] The curing agent includes diethylenetriamine, xylylenediamine, m-phenylenediamine, and 120 curing agent.
[0036] The curing accelerator is an epoxy resin curing accelerator.
[0037] The fi...
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