Floor
A technology for flooring and composite boards, applied in the directions of non-polymer adhesive additives, adhesive types, floors, etc., can solve the problems of cumbersome construction, lower floor height, high heat absorption and energy consumption, etc., to improve the stability of gluing The effect of improving the bonding strength and improving the service life
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Embodiment 1
[0025] Such as figure 1 The floor shown here includes a first composite board 1, a second composite board 2, an adjustment reinforcement layer 3, and one side of the adjustment reinforcement layer 3 passes through a first single-component epoxy resin adhesive powder adhesive layer 4 and the first The composite board 1 is adhesively connected, and the other side of the adjustment reinforcement layer 3 is adhesively connected to the second composite board 2 through a second single-component epoxy resin adhesive layer 5.
[0026] The first composite board 1 can be any one of wood, bamboo, ceramic tiles, and metal, and the second composite board 2 can be any one of wood, bamboo, ceramic tiles, metal, and stone.
[0027] The adjustment reinforcement layer 3 can be any one of wood, foam plastic, and foam board. The adjustment and reinforcement layer 3 can be customized according to customer needs, thereby improving the practicality of the floor.
[0028] A floor heating pipe 6 is install...
Embodiment 2
[0040] The structure of the floor is the same as in Example 1, but the difference lies in the proportion of the one-component epoxy resin powder.
[0041] The parts by weight of the components in the rubber powder are: 100 parts of original epoxy resin powder, 0.454 parts of hydroxypropyl methylcellulose, 4.54 parts of 1-butyl-3 methylimidazole chloride ionic liquid, and liquid butyronitrile 10 parts of rubber, 3 parts of magnesium acetylacetonate, 1 part of limestone powder, 3 parts of allyl succinimidyl carbonate, 1.5 parts of 2,3,5-trimethylpyrazine, 0.75 parts of bromomethane triphenylphosphonium salt , 0.5 part of N,N-bis(hydroxyethyl) cocamide;
[0042] The liquid nitrile rubber has a model of liquid nitrile rubber-34. The molecular weight of liquid nitrile rubber-34 is 3800-4500, the viscosity is 450pa.s when the temperature is 23 degrees, and the acrylonitrile content is 34%;
[0043] A preparation method of one-component epoxy resin powder includes the following steps:
[0...
Embodiment 3
[0050] The structure of the floor is the same as in Example 1, but the difference lies in the proportion of the one-component epoxy resin powder.
[0051] The weight parts of the components in the rubber powder are: 120 parts of epoxy resin raw powder, 0.91 parts of hydroxypropyl methyl cellulose, 9.01 parts of 2-ethyl-4-methyl imidazole bromide ionic liquid, liquid butyl 20 parts of nitrile rubber, 6 parts of cobalt acetylacetonate, 2 parts of limestone powder, 5 parts of allyl succinimidyl carbonate, 2 parts of 2,3,5-trimethylpyrazine, 1 part of bromomethane triphenylphosphonium salt Parts, 0.7 parts of N,N-bis(hydroxyethyl) cocamide;
[0052] The liquid nitrile rubber is liquid nitrile rubber-40. The molecular weight of liquid nitrile rubber-40 is 6000-8000, the viscosity is 850pa.s at a temperature of 23 degrees, and the acrylonitrile content is 40%.
[0053] A preparation method of one-component epoxy resin powder includes the following steps:
[0054] (1) First, 2-ethyl-4-meth...
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Abstract
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