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High-dielectric electronic adhesive for flexible film capacitor and preparation method of high-dielectric electronic adhesive

A flexible film and adhesive technology, applied in the direction of non-polymer adhesive additives, adhesives, adhesive additives, etc., can solve the problem of large capacitor size and difficult to meet

Inactive Publication Date: 2018-01-19
深圳市峰泳科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the size of the capacitors formed by the packaging of these thin film capacitor materials is still large, and it is difficult to meet the technical requirements of modern electronic products for capacitor planarization and thin filmization.

Method used

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  • High-dielectric electronic adhesive for flexible film capacitor and preparation method of high-dielectric electronic adhesive
  • High-dielectric electronic adhesive for flexible film capacitor and preparation method of high-dielectric electronic adhesive
  • High-dielectric electronic adhesive for flexible film capacitor and preparation method of high-dielectric electronic adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Embodiment 1 A kind of high dielectric body adhesive for flexible film capacitor

[0031] The high-dielectric adhesive for flexible film capacitors of this embodiment is prepared from the following raw materials in parts by weight:

[0032]

[0033] The preparation method of the high dielectric adhesive for the flexible film capacitor of the present embodiment comprises the following steps:

[0034] 1. First mix epoxy resin E-51 and 25 parts of methyl ethyl ketone, and stir ultrasonically. After epoxy resin E-51 is fully dissolved, add 2-methylimidazole, dicyandiamide, triethyl phosphate and Resiflow P -67 full stirring (stirring speed is 300 rpm) for 60 minutes to form solution A;

[0035] 2. BaTiO 3 Nanofillers are dispersed in 25 parts of methyl ethyl ketone solution, ultrasonically stirred for 60 minutes (stirring speed is 300 rpm), then add OFS-6020 and BYK-110 and continue to stir for 60 minutes, then pour the mixture and solution A into the ball mill The hi...

Embodiment 2

[0036] Embodiment 2 A kind of high dielectric body adhesive for flexible film capacitor

[0037] The high-dielectric adhesive for flexible film capacitors of this embodiment is prepared from the following raw materials in parts by weight:

[0038]

[0039] The preparation method of the high dielectric adhesive for the flexible film capacitor of the present embodiment comprises the following steps:

[0040] 1. First, mix 25 parts of epoxy resin GY 2600, E-44, butanone-toluene mixture, and stir ultrasonically. After the resin is fully dissolved, add curing agent DDS, stir well and then add curing accelerator 2-ethyl- 4 Methylimidazole, continue to stir at a stirring speed of 300 rpm for 60 minutes to form solution A;

[0041] 2. Disperse the filler in 25 parts of methyl ethyl ketone-toluene mixed solution, stir ultrasonically for 60 minutes (stirring speed is 300 rpm), then add OFS-6020 and keep stirring for 60 minutes, then pour the mixture and solution A into In the ball ...

Embodiment 3

[0042] Embodiment 3 A kind of high dielectric body adhesive for flexible film capacitor

[0043] The high-dielectric adhesive for flexible film capacitors of this embodiment is prepared from the following raw materials in parts by weight:

[0044]

[0045]

[0046] The preparation method of the high dielectric adhesive for the flexible film capacitor of the present embodiment comprises the following steps:

[0047] 1. First mix epoxy resin E-21 and 25 parts of methyl ethyl ketone, and stir ultrasonically. After epoxy resin E-21 is fully dissolved, add 2-methylimidazole, dicyandiamide, triethyl phosphate and Resiflow P -67 full stirring (stirring speed is 300 rpm) for 60 minutes to form solution A;

[0048] 2. Disperse the filler in 25 parts of butanone solution, stir ultrasonically for 60 minutes (stirring speed is 300 rpm), then add ED-5375 and OFS-6020 and keep stirring for 60 minutes, then pour the mixture and solution A The high dielectric electronic adhesive can b...

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Abstract

The invention discloses a high-dielectric electronic adhesive for a flexible film capacitor and a preparation method of the high-dielectric electronic adhesive. The adhesive is prepared from thermosetting resin, solid filler, a coupling agent, a dispersing agent, a flatting agent, a curing agent, an accelerant, a solvent and the like. All the components are subjected to ball milling in a ball milling tank at the rotating speed of 100-3000rpm for 0.5-72h after being preliminarily mixed and are then subjected to ultrasonic dispersion for 4-72h to obtain the high-dielectric electronic adhesive. The adhesive disclosed by the invention is excellent in dielectric property, dispersion effect and flame retardance and can be used for an embedded capacitor, a buried capacitor and a filter or used asa functional material to be applied to other related fields.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and more specifically, the invention relates to a high-dielectric electronic adhesive for flexible film capacitors and a preparation method thereof. Background technique [0002] Epoxy adhesives are widely used in aviation, aerospace, weapons, electric power, electronics and many other fields. In recent years, smart mobile terminal products represented by smart phones have developed rapidly, and electronic components and devices are gradually developing in the direction of miniaturization, multi-functionality, and thinner, which directly leads to an increasing demand for high-dielectric film capacitor components . Traditional SMT chip capacitors are generally mounted on the surface of printed boards by surface mount technology, occupying a large area, and their physical size is close to the limit, and it is difficult to further reduce it. Therefore, it is just right to develop high-dielectric ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06
Inventor 杨文虎李峰陶玉红卢星华
Owner 深圳市峰泳科技有限公司