Integrated circuit (IC) package processing device and processing method
A technology for processing devices and packages, applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of long processing cycle, high cost, cumbersome control, etc., and achieve smooth control between processes, easy stripping, and optimization The effect of encapsulation process
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Embodiment 1
[0036] like figure 1 As shown, it shows a schematic diagram of the working state of the IC package processing device in this embodiment, and the device includes:
[0037] The first temperature-controlled suction cup 1 is used for adsorbing the metal carrier board 2 and heating the carrier board.
[0038] The second temperature control suction cup 4 is used for adsorbing the IC package body 3 and controlling the IC package body to be kept within the first temperature range.
[0039] A separating device is used for starting when the temperature of the metal carrier is heated to a second temperature range by the first temperature-controlled suction cup, so as to separate the metal carrier and the IC package. In this embodiment, there is a low melting point metal plating layer 5 between the metal carrier 2 and the IC package 3 .
[0040] In this embodiment, the working process of the device includes: the IC package to be processed is sent into the processing device, such as fi...
Embodiment 2
[0043] like figure 1 As shown, it shows a schematic diagram of the working state of the IC package processing device in this embodiment, and the device includes:
[0044] The first temperature-controlled suction cup 1 is used for adsorbing the metal carrier board 2 and heating the carrier board. In a specific device configuration, the suction cup may include a heating unit and an adsorption unit. The heating unit can adopt a non-contact heating method or a contact heating method.
[0045] In some instances, contact and non-contact heating units can also be used simultaneously to meet the requirements of different temperature control and heating modes.
[0046] In some examples, the non-contact heating unit includes a high frequency electromagnetic heating subunit.
[0047] In some examples, the contact heating unit includes at least one of an electrical heating subunit and a heat medium heating subunit.
[0048]In some examples, the adsorption unit of the first temperature...
Embodiment 3
[0055] like image 3 , 4 As shown, this embodiment discloses a method for post-processing the IC package, including the following steps:
[0056] Step 1. Inserting step: placing the non-metallic side of the IC package to be processed into the second temperature-controlled suction cup.
[0057] Specifically, the second temperature-controlled suction cup can be a vacuum adsorption suction cup, such as a porous negative pressure adsorption device. The porous negative pressure adsorption device can have a disk-shaped shape, and gas circulation pipes are distributed on its surface, and the pump device can be used to pump air to the outside through the gas circulation pipes, so as to realize negative pressure on the surface of the suction cup and the adsorbed object, so that the two are closely connected. connect.
[0058] There is a cooling medium inside the suction cup, and when the temperature exceeds a predetermined value, the temperature of the IC package absorbed by the sec...
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