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Halogen-free resin composition, and glue film, cover film and copper-clad plates prepared from halogen-free resin composition

A technology of resin composition and epoxy resin, which is applied in the direction of epoxy resin glue, film/sheet without carrier, adhesive, etc., can solve the problems of low peel strength, poor heat resistance and aging resistance, and achieve peel strength Effects of high retention rate, high flexibility, and excellent heat resistance

Active Publication Date: 2018-02-09
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, polyurethane is affected by the structure of urethane, and its heat resistance and aging resistance are poor, and its peel strength after tin immersion is low

Method used

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  • Halogen-free resin composition, and glue film, cover film and copper-clad plates prepared from halogen-free resin composition
  • Halogen-free resin composition, and glue film, cover film and copper-clad plates prepared from halogen-free resin composition
  • Halogen-free resin composition, and glue film, cover film and copper-clad plates prepared from halogen-free resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0097] With the carboxyl-containing polyester resin of 90 weight parts (BX-39SS provided by Toyobo Co., Ltd. of Japan), the o-cresol type epoxy resin of 8 weight parts (KEC-2185A75 provided by Korea Cologne Company), 2 weight parts of Triglycidyl p-aminophenol (AFG-90 provided by Shanghai Huayi Company), 25 parts by weight of nitrogen-containing flame retardant (MC-5S provided by Mitsubishi Gas Company of Japan) and 50 parts by weight of butanone (MEK ) solvents are mixed and stirred to obtain a halogen-free resin composition (resin glue).

[0098] The resin glue was coated on a polyimide film (Taimide TL-012, Taiwan Damai) with a thickness of 12.5 μm by a coating machine, and the thickness of the glue (dry glue) was controlled to be 15 μm, and then the Bake in the high-temperature test box for 2 minutes to form a partially cross-linked and cured adhesive layer on the polyimide film, and then laminate the release paper (thickness 50 μm, Japan Sumitomo Chemical Co., Ltd.) with ...

Embodiment 2

[0100] With the carboxyl-containing polyester resin of 70 weight parts (BX-39SS provided by Toyobo Co., Ltd. of Japan), the o-cresol type epoxy resin of 25 parts by weight (KEC-2185A75 provided by Korea Cologne Company), 5 parts by weight of Triglycidyl p-aminophenol (AFG-90 provided by Shanghai Huayi Company), 25 parts by weight of nitrogen-containing flame retardant (MC-5S provided by Mitsubishi Gas Company of Japan) and 75 parts by weight of butanone (MEK ) solvents are mixed and stirred to obtain a halogen-free resin composition (resin glue).

[0101] In a similar manner to Example 1, a cover film for a flexible printed circuit board was prepared.

Embodiment 3

[0103] With the carboxyl-containing polyester resin of 80 weight parts (BX-39SS provided by Toyobo Co., Ltd. of Japan), the o-cresol type epoxy resin of 17 weight parts (KEC-2185A75 provided by Korea Cologne Company), 3 weight parts of Triglycidyl p-aminophenol (AFG-90 provided by Shanghai Huayi Company), 15 parts by weight of nitrogen-containing flame retardant (MC-5S provided by Mitsubishi Gas Company of Japan) and 45 parts by weight of butanone (MEK ) solvents are mixed and stirred to obtain a halogen-free resin composition (resin glue).

[0104] In a similar manner to Example 1, a cover film for a flexible printed circuit board was prepared.

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Abstract

The invention provides a halogen-free resin composition, and glue film, cover film and copper-clad plates prepared from the halogen-free resin composition. The halogen-free resin composition comprises, by weight, 60 to 100 parts of a carboxyl-containing polyester resin, 5 to 30 parts of a multifunctional epoxy resin, 0.5 to 10 parts of a nitrogen-containing epoxy compound, 10 to 40 parts of a fireretardant, and 40 to 100 parts of a solvent. The glue film, the cover film and the copper-clad plates prepared from the halogen-free resin composition possesses following advantages: no halogen is contained, high temperature resistance and aging resistance are excellent, and flexibility and peeling strength are high.

Description

technical field [0001] The invention relates to the technical field of flexible printed circuit boards, in particular to a halogen-free resin composition and an adhesive film, a cover film and a copper-clad board prepared therefrom. Background technique [0002] Adhesive film, cover film and copper clad laminate are the basic materials for making flexible printed circuit boards. With the development of electronic information technology, the market has higher and higher requirements for its performance, especially heat resistance, aging resistance, flame retardant properties and adhesive properties. The more common adhesives used for adhesive films, cover films and three-layer flexible copper-clad laminates use epoxy resin / nitrile rubber as the main component and are combined with curing agents, flame retardants and other auxiliary components, and their peel strength is generally low. , poor heat resistance and aging resistance. For improving heat resistance, Chinese patent...

Claims

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Application Information

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IPC IPC(8): C08L67/00C08L63/00C09J167/00C09J163/00C09J7/10C09J7/30C09J7/25B32B15/08B32B15/20B32B7/12
CPCB32B7/12B32B15/08B32B15/20B32B2307/3065B32B2457/08C08L67/00C08L2201/02C08L2201/08C08L2201/22C08L2203/20C08L2205/04C09J7/00C09J167/00C09J2203/326C09J2467/00C09J2479/086C09J2301/408C08L63/00
Inventor 闫增阳茹敬宏伍宏奎
Owner GUANGDONG SHENGYI SCI TECH
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