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Surface-treated copper foil and copper-clad laminates or printed wiring boards manufactured using the surface-treated copper foil

A technology for printed wiring boards and copper-clad laminates, which is applied in the directions of printed circuits, printed circuit manufacturing, and layered product processing, etc. It can solve the problem of excessive copper foil surface area, no consideration of reflow soldering heat resistance, and expected transmission characteristics Inferiority and other problems, to achieve the effect of satisfying heat resistance and transmission characteristics, and low dielectric loss tangent

Active Publication Date: 2019-12-10
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When such a copper foil is applied to a high-frequency circuit board, the contact area between the copper foil and the resin is increased, so that good adhesion can be ensured, but since the surface area of ​​the copper foil is too large, it is expected that the transmission characteristics will be poor. And no consideration has been given to reflow soldering heat resistance

Method used

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  • Surface-treated copper foil and copper-clad laminates or printed wiring boards manufactured using the surface-treated copper foil
  • Surface-treated copper foil and copper-clad laminates or printed wiring boards manufactured using the surface-treated copper foil
  • Surface-treated copper foil and copper-clad laminates or printed wiring boards manufactured using the surface-treated copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0100] A 18-micrometer-thick non-roughened (surface roughness Rz: about 1.1 micrometer) copper foil substrate was surface-treated under the following conditions to produce a surface-treated copper foil.

[0101] (1) Formation of roughened layer

[0102] When roughening the surface of the copper foil base, roughening plating treatment 1 and roughening plating treatment 2 shown below were sequentially performed to form a roughening layer.

[0103] (rough surface plating treatment 1)

[0104] It implemented under the conditions shown in Table 1.

[0105](rough surface plating treatment 2)

[0106]

[0107] (2) Formation of Ni-containing base layer

[0108] After forming a roughened layer on the surface of the copper foil substrate, electroplating is performed on the roughened layer under the Ni plating conditions shown below to form a base layer (the amount of Ni deposited is 0.06 mg / dm 2 ).

[0109]

[0110]

[0111] (3) Formation of Zn-containing heat-resistant tre...

Embodiment 2〕～〔 Embodiment 20

[0124] The roughening plating treatment 1 was implemented under the conditions shown in Table 1, and the other treatments were performed under the same conditions as in Example 1.

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Abstract

The present invention provides a surface-treated copper foil or the like suitable for use in a copper-clad laminate or a printed wiring board that can cope with high-performance / high-functionality of high-frequency information communication equipment. The surface-treated copper foil M of the present invention is used to form a copper-clad laminate through lamination and adhesion with the first resin base material B1 with a dielectric constant of 2.6 to 4.0, and on the bonding surface with the first resin base material B1 It has a surface treatment layer that satisfies Condition 1 shown below. Condition 1: When the second resin base material B2 is laminated and adhered to the surface of the first resin base material B1 obtained by etching the entire copper foil portion from the copper-clad laminate, the first resin base material B1 and the second resin base material B1 The interface height H of the adhesion interface S of the two resin substrates B2 is 0.15 to 0.85 μm, and the number of unevennesses present on the adhesion interface S is 11 to 30 per width of 2.54 μm.

Description

technical field [0001] The present invention relates to a surface-treated copper foil and a copper-clad laminate or a printed wiring board manufactured using the surface-treated copper foil. For servers etc. Background technique [0002] In recent years, with the increase in performance and functionality of computers and information communication equipment, and the development of networking, there is a tendency for signals to increase in frequency in order to transmit and process large-capacity information at high speed. Such information and communication equipment uses copper-clad laminates. Copper-clad laminates are produced by heating and pressing an insulating substrate (resin substrate) and copper foil. [0003] Generally, resins with excellent dielectric properties must be used for insulating substrates constituting high-frequency copper-clad laminates, but there is a tendency that resins with low relative permittivity and dielectric loss tangent are favorable for bo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D7/06B32B15/08B32B15/20H05K1/09
CPCB32B15/08B32B15/20C25D7/06H05K1/09B32B2310/04B32B2457/08C25D5/48C25D5/605H05K3/389
Inventor 佐藤章宇野岳夫座间悟
Owner FURUKAWA ELECTRIC CO LTD