Matched magnetic core of patch type inductance magnetic core and manufacturing method of matched magnetic core

Abstract

The invention discloses a matched magnetic core of a patch type inductance magnetic core and a manufacturing method of the matched magnetic core. The matched magnetic core is a rectangular thin sheetmade of Mn-Zn ferrite material. The manufacturing method of the matched magnetic core comprises the steps of 1) fabricating a sintered blank of the matched magnetic core by employing a Mn-Zn ferrite;2) taking a smooth zirconium sheet as a spacer; and 3) placing the sintered blank of the matched magnetic core on a burning bearing plate, performing sintering in a bell-type furnace according to a balance atmosphere mode, and performing constant-temperature sintering for 6 hours at 1,365 DEG C to obtain a finished product, wherein the temperature rising rate is 0.85 DEG C per minute at a room temperature to 400 DEG C, the temperature rising rate is 1.25 DEG C per minute at 400-800 DEG C, and the oxygen-containing content accounts for 3.66-4.14% of the atmosphere in the furnace at a constant-temperature stage based on percent by volume. The matched magnetic core obtained by the invention is high in smoothness, the matched magnetic core is not needed to be grinded and processed, so that theproduct damage rate is greatly reduced, the product yield is improved, and the manufacturing cost is reduced.

Description

technical field [0001] The invention relates to the technical field of magnetic cores, in particular to an inductive magnetic core and a manufacturing method thereof. Background technique [0002] Network inductance cores and filter inductance cores used toroidal cores (Toroid, T CORE) in the past. Device manufacturers need to design box packaging, manually wind the core, assemble the wound core into the box, and click Glue, solder, cut wires, and then insert and solder the semi-finished device on the substrate. The existing toroidal magnetic cores have disadvantages such as inconvenient winding, need to design additional box packaging, easy welding and desoldering, and occupy a large volume; moreover, the process is complicated, more man-hours are required to assemble the device, and the manufacturing cost is high. [0003] Surface mount technology (SMT) has high assembly density, small size and light weight of electronic products. The volume and weight of SMT components a...

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Problems solved by technology

[0005] In view of this, the purpose of the present invention is to provide a paired magnetic core of a patch-type inductance magnetic core and its manufacturing method, to solve the problem that the existing inductance magnetic core needs to be improved by grinding, which leads to a high damage rate of the product during the grinding process. , a technical problem with high production costs

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