Flexible copper clad substrate capable of preventing open/short circuit and manufacturing method thereof
A technology of copper clad substrate and manufacturing method, which is applied in the manufacture of printed circuits, the removal of conductive materials by chemical/electrolytic methods, the manufacture of printed circuit precursors, etc., can solve the problem of reducing the yield and reliability of FPCB electronic equipment, uneven copper Pattern plating, unevenness, etc.
Active Publication Date: 2020-11-03
SK NEXILIS CO LTD
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Problems solved by technology
[0008] However, when the polishing rate is not uniform during the chemical polishing process on all surfaces of the copper layer, unevenness occurs on some areas of the copper layer
Unevenness on the copper layer Unevenness leads to uneven copper pattern plating
[0009] Due to uneven copper pattern plating, a part of the copper layer to be removed during circuit patterning will partially remain and cannot be completely removed, so a short circuit will occur, or a part of the copper layer to be left during circuit patterning will be removed, so an open circuit will occur
[0010] Such a short or open circuit not only reduces the yield and reliability of the FPCB, but also reduces the yield and reliability of the electronic equipment to which the FPCB is applied.
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1 to 6 and comparative example 1 to 12
[0076] The polyimide film is subjected to plasma surface treatment by drying the polyimide film by an infrared (IR) heater. Next, a thickness of NiCr coating. Next, a thickness of copper seed layer. Subsequently, electroplating was performed under different conditions (as shown in Table 1 below) to form a copper plating layer with a thickness of 2 μm, thereby completing the FCCLs of Examples 1 to 6 and Comparative Examples 1 to 12.
[0077] In Table 1 below, the maximum current density is understood to mean the maximum current density among the current densities provided in the electroplating bath.
[0078] Table 1
[0079]
[0080]
[0081] The FCCLs manufactured according to these Examples and Comparative Examples were chemically polished by spraying copper etchant (20% diluted solution of MFE-500 manufactured by Poongwon Chemical Co., Ltd) thereon to control the final thickness of the copper layer to be 0.8 μm (ie, the thickness of the copper seed layer + the th...
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Abstract
The present invention provides a flexible copper-clad substrate capable of preventing occurrence of an open circuit and / or a short circuit by ensuring uniform chemical polishing and a manufacturing method thereof. The flexible copper-clad substrate includes a non-conductive polymer substrate, a first coating on the non-conductive polymer substrate, and a first copper layer on the first coating. Wherein, when chemical polishing is performed to reduce the thickness of the first copper layer by 1 μm to 2 μm, the surface roughness of the polished first copper layer is 0.1 μm to 0.15 μm, and the average size of copper grains in the normal direction is 2μm or less.
Description
technical field [0001] The present invention relates to a flexible copper-clad substrate and a manufacturing method thereof, in particular to a flexible copper-clad substrate capable of preventing open circuits and / or short circuits and a manufacturing method thereof. Background technique [0002] As electronic devices such as notebook computers, mobile phones, personal digital assistants (PDA), small cameras, and electronic notebooks become smaller and lighter, they are suitable for tape automated bonding (TAB), film Demand for flexible printed circuit boards (FPCB) such as flip-chip packages (chip-on-film, COF) is increasing. Therefore, the demand for flexible copper clad laminate (FCCL) for manufacturing FPCB is also increasing. [0003] FCCLs include a stacked structure of non-conductive polymer films and copper layers. The FPCB can be obtained by selectively removing the copper layer from the FCCL and forming a circuit pattern on a non-conductive polymer film. [000...
Claims
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IPC IPC(8): H05K3/06H05K1/11
CPCH05K1/11H05K3/06H05K2203/0307H05K3/108H05K3/007H05K3/025H05K3/384H05K1/09C25D7/0614C25D3/38C25D5/34C23C14/022C23C14/165C23C14/205
Inventor 李满炯柳汉权宋炳吉廉贞恩
Owner SK NEXILIS CO LTD