Diamond/aluminum composite and efficient preparation method thereof

An aluminum composite material and composite material technology, applied in the field of diamond/aluminum composite material and its preparation, can solve the problems of insufficient interface reaction between diamond and aluminum, weak interface bonding, low thermal conductivity, etc., and achieve satisfactory and improved forming accuracy Interface bonding strength, effect of improving thermal conductivity

Active Publication Date: 2018-02-27
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The present invention proposes a diamond/aluminum co

Method used

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  • Diamond/aluminum composite and efficient preparation method thereof
  • Diamond/aluminum composite and efficient preparation method thereof
  • Diamond/aluminum composite and efficient preparation method thereof

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specific Embodiment approach 1

[0043] Specific embodiment 1: This embodiment is a diamond / aluminum composite material composed of aluminum metal and diamond powder with a coating layer, and the aluminum metal is filled in the gaps of the diamond powder with a coating layer;

[0044] The aluminum metal is pure aluminum or aluminum alloy;

[0045] The coating layer of the diamond powder with a coating layer is one layer or more than two layers;

[0046] The material of the coating layer is Ti, Cr, W, Mo or Zr;

[0047] The volume fraction of diamond powder in the diamond / aluminum composite material is 50%-60%.

[0048] This embodiment has the following beneficial effects:

[0049] The density of the diamond / aluminum composite material in this embodiment is above 99.8%, which solves the problem of low density of the diamond / aluminum composite material; the coating layer on the surface of the single crystal diamond powder in this embodiment improves the density of the diamond powder and aluminum metal. The wettability, t...

specific Embodiment approach 2

[0050] Specific embodiment two: this embodiment is different from specific embodiment one in that the thickness of the coating layer is 30-500 nm. The other steps and parameters are the same as in the first embodiment.

specific Embodiment approach 3

[0051] Specific embodiment three: This embodiment is different from specific embodiment one or two in that the particle size of the diamond powder is 10-300 μm. The other steps and parameters are the same as in the first or second embodiment.

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Abstract

The invention relates to diamond/aluminum composites and preparation methods of the diamond/aluminum composites, in particular to a diamond/aluminum composite and an efficient preparation method of the diamond/aluminum composite. The diamond/aluminum composite and the efficient preparation method of the diamond/aluminum composite aim to solve the problems that a diamond/aluminum composite preparedin the prior art is poor in interface bonding strength and low in heat conductivity, infiltration efficiency and density, and the interfacial reaction of diamond and aluminum is insufficient. The diamond/aluminum composite is composed of aluminum metal and diamond powder with a coating film layer, and intervals of the diamond powder with the coating film layer are filled with the aluminum metal.The efficient preparation method of the diamond/aluminum composite comprises the steps of firstly, preparing a near-net forming mold; secondly, coating the surface of the diamond powder with the film;thirdly, conducting pressure infiltration preparation, fourthly, conducting pressure infiltration and fifthly conducting demolding. The density of the diamond/aluminum composite reaches 99.8% or over, the production efficiency is improved, the raw material cost is reduced, and the interface bonding strength and the heat conductivity are improved. The efficient preparation method is suitable for preparation of the diamond/aluminum composite.

Description

Technical field [0001] The invention relates to a diamond / aluminum composite material and a preparation method thereof Background technique [0002] The rapid development of the electronics industry in recent years has caused the power consumption of circuits to increase, which has severely increased the reliability and life requirements of key electronic components such as chips. In the field of electronic communication, the power consumption of the chip is almost increasing at a rate of more than 50% per year. Existing electronic packaging materials used for heat conduction, such as molybdenum copper, tungsten copper, and silicon carbide aluminum, have become increasingly difficult to meet industry needs, and even become a bottleneck restricting industry development. The thermal conductivity of diamond / aluminum composite materials is more than twice that of molybdenum or copper, and has an appropriate thermal expansion coefficient, which has attracted more and more attention f...

Claims

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Application Information

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IPC IPC(8): C22C26/00C22C1/10
CPCC22C1/1036C22C26/00C22C1/1073
Inventor 武高辉丁伟张强苟华松陈国钦修子扬姜龙涛康鹏超杨文澍
Owner HARBIN INST OF TECH
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