High-purity gas cylinder inner wall MOCVD nickel plating device and method

Abstract

The invention discloses a high-purity gas cylinder inner wall MOCVD nickel plating device and method. The device comprises a decomposer, a heater, a temperature measurement thermocouple, a nickel carbonyl gas inlet pipe, a CO / N2 gas inlet connecting pipe, a CO gas inlet pipe, a N2 gas inlet pipe, a gas outlet pipe, an exhaust discharging pipe, a decomposer connecting pipe, a pressure meter, a nickel carbonyl gas inlet control vavle, a CO / N2 gas inlet control valve, an exhaust discharging control valve and a decomposition treatment control valve. By means of the high-purity gas cylinder inner wall MOCVD nickel plating device, the flow, concentration and temperature of gas entering a high-purity gas cylinder can be controlled; the internal pressure of the high-purity gas cylinder is maintained to be within a reasonable range; nickel is deposited at a certain pressure and temperature through the mixed gas of nickel carbonyl and CO, a nickel-plated layer which is compact, continuous, uniform and smooth can be formed on the inner wall of the high-purity gas cylinder, the nickel-plating requirement of the high-purity gas cylinder can be well met, and the problem that the prior art is notapplicable to uniform nickel-plating of irregular containers can be well solved; and the high-purity gas cylinder inner wall MOCVD nickel plating device is not only applicable to nickel-plating of the inner wall of the high-purity gas cylinder but also can be widely applied to nickel-plating operation of large-size objects of complex structures.

Description

technical field [0001] The invention belongs to the technical field of carbonyl metallurgy production, and in particular relates to an MOCVD nickel plating device and method for the inner wall of a high-purity gas cylinder. Background technique [0002] With the rapid development of the modern electronics industry, especially the demanding precision processing requirements in the production of very large scale integrated circuits (VLSI), represented by high-purity gases used in large quantities in chip factories, the purity of raw materials has changed from 30 years ago. 99.9% has jumped to the current 99.9999%, and some have reached 99.9999999%. Such harsh gas purity also requires higher and higher cleanliness inside the packaging gas cylinder. The polishing and nickel-phosphorus plating (electroless chemical plating) treatment on the inside of the steel cylinder in the traditional process has been difficult to meet the pollution problem of the package in the production an...

AI Technical Summary

Problems solved by technology

However, this method has shortcomings such as large differences in the thickness of the nickel coating due to the uneven current density passing through the surface of the object to be plated, hydrogen embrittlement of the coating, obstacles to the nickel plating process of large-scale and complex objects, and low efficiency. Demand for high-purity gas cylinders

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