Polyesteramide acids and photosensitive compositions containing same

A polyester amic acid and compound technology, which is applied in the production field of the photosensitive polymer, can solve the problem of unrecorded analytical size, etc., and achieve the effects of excellent residual film rate, excellent analytical performance, and excellent flatness

Inactive Publication Date: 2018-03-09
JNC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with regard to photosensitive compositions containing these photosensitive polymers, practical analytical dimensions are not described in the literature, and the production steps of photosensitive polymers are complicated systems, and usable raw materials are limited by production conditions. etc., so there is still room for improvement

Method used

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  • Polyesteramide acids and photosensitive compositions containing same
  • Polyesteramide acids and photosensitive compositions containing same
  • Polyesteramide acids and photosensitive compositions containing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0245] Next, the present invention will be specifically explained through examples and comparative examples, but the present invention is not limited by these examples at all.

Synthetic example 1

[0246] [Synthesis example 1] Synthesis of polyester amic acid (A1) with polymerizable double bond

[0247] In a four-necked flask equipped with a stirrer, propylene glycol monomethyl ether acetate (PGMEA), 1,2,3,4-butane tetrahydrofuran (PGMEA), 1,2,3,4-butane, which have been dehydrated and purified, are sequentially charged with the following weights: Carboxylic dianhydride (BT-100), SMA1000P (trade name; styrene-maleic anhydride copolymer, Sichuan Petrochemical Co., Ltd.), benzyl alcohol, 4-hydroxybutyl acrylate glycidyl ether (4HBAGE), Stirring was performed at 125°C for 6 hours under a stream of dry nitrogen (the first step of synthesis).

[0248]

[0249] After that, the reacted solution was cooled to 25°C, 3,3'-diaminodiphenylsulfone (DDS) and PGMEA were added with the following weights, and stirred at 20°C to 30°C for 2 hours, and then heated at 125°C Under stirring for 1 hour (the second step of synthesis).

[0250] DDS 0.79g

[0251] PGMEA 6.74g

[0252] [Z / Y=2.7, (Y+Z) / X=0...

Synthetic example 8

[0259] [Synthesis example 8] Synthesis of polyester amic acid (A8) with polymerizable double bond

[0260] In a four-necked flask with a stirrer, propylene glycol monomethyl ether acetate (PGMEA), 1,2,3,4-butane tetracarboxylic dianhydride (BT -100), SMA1000P (trade name; styrene·maleic anhydride copolymer, Sichuan Crude Oil & Chemical Co., Ltd.), benzyl alcohol, stirred for 2 hours at 125°C under a stream of dry nitrogen (the first step of synthesis).

[0261]

[0262] After that, the reacted solution was cooled to 25°C, 3,3'-diaminodiphenylsulfone (DDS) and PGMEA were added with the following weights, and stirred at 20°C to 30°C for 2 hours, and then heated at 125°C Under stirring for 1 hour (the second step of synthesis).

[0263] DDS 0.60g

[0264] PGMEA 4.41g

[0265] After that, the reacted solution was cooled to 25°C, and glycidyl methacrylate (GMA), 1-methylimidazole (NMI), and 4-methoxyphenol (MQ) were added with the following weights at 80°C Stirring was carried out for 8 h...

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Abstract

The present invention relates to polyesteramide acids and photosensitive compositions containing the same, and especially to a polyesteramide acid (A) which becomes a component of the photosensitive composition in which the resolving potency and the residual film rate are excellent.In the polyesteramide acid (A), tetracarboxylic acid dianhydride of X mole, diamine of Y mole, multiple hydroxy compound of Z mole, and kation polymerization ring ether compound having a polymeric double bond of W mole are included to the rate in which the relation of the following equation (1), the equation (2) andthe equation (3) are made. 0.2<=Z/Y<=8.0 (1), 0.2<=Z(Y+Z)/X<=5.0 (2), 0.05<=ZW/2X<=1.0 (3)

Description

Technical field [0001] The present invention relates to a photosensitive polymer and a photosensitive composition containing the photosensitive polymer. The present invention relates to a cured film formed of the photosensitive composition, a color filter, an insulating film, a protective film, and the like using the cured film. Furthermore, this invention relates to the manufacturing method of the said photosensitive polymer. Background technique [0002] In the usual manufacturing steps of elements such as display elements, chemical treatments or high-temperature heat treatments are applied to their surfaces. In order to prevent deterioration, damage, and deterioration caused by the treatment, a protective film is provided on the surface of the element. The protective film requires heat resistance, chemical resistance, adhesion to the substrate, transparency, flatness, etc., as well as good resolution and residual film rate. [0003] In order to form a protective film, it is r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/16G03F7/004G03F7/027
CPCC08G73/16G03F7/004G03F7/027C08G73/1014G03F7/028
Inventor 横手友纪藤马佐知子江头友弘
Owner JNC CORP
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