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Heat-curable epoxy resin composition

A technology of epoxy resin and liquid epoxy resin. It is applied in the field of thermosetting epoxy resin composition. It can solve the problems of poor low-temperature melting, B-level residual solvent, and difficulty in obtaining a uniform coating film, etc., and achieve high strength and high heat resistance. , low water absorption effect

Inactive Publication Date: 2018-03-13
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since this resin composition uses a thermoplastic high-molecular-weight polyamide-imide resin, it has poor low-temperature meltability and poor compatibility with maleimide compounds, which may cause problems when the coating film is cured. Phase separation, and it is difficult to obtain a uniform coating film
In addition, due to the use of high boiling point solvents such as NMP, there is a problem of residual solvents in Class B

Method used

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  • Heat-curable epoxy resin composition
  • Heat-curable epoxy resin composition
  • Heat-curable epoxy resin composition

Examples

Experimental program
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Effect test

preparation example Construction

[0081] [Preparation method of the mixture]

[0082] The thermosetting epoxy resin composition of the present invention can be prepared by the method shown below. For example, by mixing and stirring (A) epoxy resin, (B) aromatic amine curing agent, and (C) cyclic carbodiimide compound simultaneously or separately as necessary while heat-treating, dissolve and / or Disperse to obtain a mixture of (A) to (C) components. In addition, there is also a mixture of (A) to (D) components obtained by adding (D) inorganic filler to the mixture of (A) to (C) components, stirring, dissolving and / or dispersing Methods. Further, according to the application, at least one of (E) additive of curing accelerator, release agent, flame retardant and ion trapping agent can also be added and mixed in the mixture of (A)~(C) components or ( A) ~ (D) in the mixture of components. Each component of (A)-(E) may be used individually by 1 type, and may use 2 or more types together.

[0083] The preparati...

Embodiment

[0085] Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, this invention is not limited to a following example.

[0086] About Examples 1-10 and Comparative Examples 1-6, each component shown below was mix|blended according to the composition shown in Table 1, and the thermosetting epoxy resin composition was prepared. It should be noted that in Table 1, the amounts of the respective components represent parts by mass. The equivalent represents the equivalent of all the amino groups in the (B) component relative to 1 equivalent of all the epoxy groups in the (A) component.

[0087] (A) Liquid epoxy resin

[0088] (1) Epoxy resin (A1): bisphenol F type epoxy resin (YDF-8170: manufactured by Mitsubishi Chemical Corporation)

[0089] (2) Epoxy resin (A2): Naphthalene type epoxy resin (HP-4032D: made by DIC Corporation)

[0090] (3) Epoxy resin (A3): Aminophenol type trifunctional epoxy resin (jER-630: manufacture...

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Abstract

Provided is a heat-curable epoxy resin composition capable of yielding a cured product exhibiting a high heat resistance, a low water absorbability and a high strength. The composition of the invention is a heat-curable resin composition containing a liquid epoxy resin (A), an aromatic amine-based curing agent (B) and a cyclic carbodiimide compound (C). The aromatic amine-based curing agent (B) isadded in an amount at which a total of all the amino groups in the aromatic amine-based curing agent (B) will be in an amount of 0.7 to 1.5 equivalents per one equivalent of all the epoxy groups in the liquid epoxy resin (A). The cyclic carbodiimide compound (C) is in an amount of 2 to 50 parts by mass per a total of 100 parts by mass of the liquid epoxy resin (A) and the aromatic amine-based curing agent (B).

Description

technical field [0001] This invention relates to thermosetting epoxy resin compositions. Background technique [0002] In recent years, in the field of semiconductor-related materials, the miniaturization of electronic devices such as mobile phones, smartphones, ultra-thin liquid crystal TVs, plasma TVs, and lightweight notebook computers has been advancing. Electronic components used in semiconductor-related materials are also being advanced for high-density integration and further high-density packaging. Therefore, low expansion is required for resin materials used for semiconductor-related materials in view of the stress relationship. In addition, heat resistance is required for resin materials due to increased heat generation from electronic components accompanying high integration. [0003] Cyanate resins have been known so far as thermosetting resins that are not only excellent in heat resistance but also have low viscosity, low dielectric constant, and low dielectri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/36C08K5/29C08K5/35C08G59/50
CPCC08G59/5033C08K3/36C08K5/29C08K5/35C08L63/00C08G59/4014C08G59/4042C08G59/504C08K3/013C08G59/245C08G59/28C08G59/5026
Inventor 串原直行隅田和昌
Owner SHIN ETSU CHEM IND CO LTD