Low-temperature cored tin solder wire and preparation method thereof
A technology of solder wire and low-temperature solder, which is applied to welding equipment, welding media, manufacturing tools, etc., can solve the problems of poor processing and forming performance, achieve the effects of improving welding performance, improving surface quality and oxidation resistance, and reducing damage
Inactive Publication Date: 2018-03-16
KUNMING UNIV OF SCI & TECH +1
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Problems solved by technology
Because SnBi solder has greater brittleness and poor processing and forming performance, especially in the wire drawing preparation process of solder wire, low temperature solder cannot complete the forming process
Method used
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preparation example Construction
[0045] The preparation method of described embodiment 1~7 low-temperature cored solder wire, concrete steps are as follows:
[0046] (1) According to the ratio of alloys for low-temperature cored solder wires in Examples 1 to 7, the elemental metals Sn, Bi, and intermediate alloys are smelted in a melting furnace at a temperature of 300°C, and covered on the surface of the melt The NaOH purifying agent is kept for 30 minutes, and degassing, impurity removal, microalloying, quenching and tempering are performed under stirring conditions to obtain a low-temperature solder alloy melt;
[0047] Among them, the master alloy is prepared in a vacuum melting furnace, and the mass ratio and melting temperature are:
[0048] Ag: Sn-10%Ag, 450°C;
[0049] Sb: Sn-10%Sb, 450°C;
[0050] P: Sn-1%P, 450°C;
[0051] Ga: Sn-40%Ga, 240°C;
[0052] Ge: Sn-1%Ge, 400°C;
[0053] Cu: Sn-10%Cu, 450;
[0054] The performance test of the low-temperature solder alloy is carried out according to t...
Embodiment 5
[0062] Example 5 The test results of the flux content of the low-temperature cored solder wire SnBi42Ag1.0In1.5 and the comparative example SnBi58 cored solder wire are shown in Table 3,
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Abstract
The invention discloses a low-temperature cored tin solder wire and a preparation method thereof, and belongs to the technical field of electronic welding. The low-temperature cored tin solder wire isprepared by adopting a micro-alloying and continuous casting extrusion method, and the low-temperature cored tin solder wire has a diameter of phi 0.3-phi 3.0 mm and a flux solder core of 0.5-4%; andthe low-temperature cored tin solder wire comprises, by weight, 25-55% of Bi, 0.01-2.5% of Ag, 0.01-5% of In, 0.1-5% of Sb, 0.01-1% of Cu, 0-0.15% of Ge, 0-0.15% of Ga, 0-0.15% of P and the balance of Sn. According to the low-temperature cored tin solder wire and the preparation method thereof, multi-element alloy elements of Ag, Sb, P, Ga, Ge and Cu are added and can obviously improve the mechanical property of the solder alloy, the enrichment of Bi can be prevented in the formed welding spots and interfaces by the multi-element alloy elements in a dispersed distribution, the generation of enriched Bi phases are also prevented, and therefore the damage of the hard and crisp enriched Bi phases to the mechanical property of welding joints is reduced and the welding property is improved; the low-temperature cored tin solder wire prepared from the method is carried out the heat preservation and internal stress treatment, and therefore the tensile property of the wire is improved; and thesurface quality and the oxidation resistance of the low-temperature cored tin solder wire are improved through constant-temperature wire drawing treatment.
Description
technical field [0001] The invention relates to a low-temperature cored solder wire and a preparation method thereof, belonging to the technical field of electronic welding. Background technique [0002] At present, in the solder industry, compared with conventional lead-free solder, low-temperature solder has the characteristics of energy saving and small thermal shock to electronic components. At present, low-temperature solder alloys mainly add alloying elements on the basis of SnBi alloys to improve the mechanical properties and soldering properties of solders. Because SnBi solder has high brittleness and poor processing and forming performance, especially in the wire drawing preparation process of solder wire, low-temperature solder cannot complete the forming process. In order to realize the preparation of low-temperature solder wire, it is necessary not only to improve the brittleness of the alloy, but also to meet the requirements of the wire drawing process with a ...
Claims
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IPC IPC(8): B23K35/26B23K35/02B23K35/40
CPCB23K35/02B23K35/262B23K35/40
Inventor 严继康陈东东白海龙刘宝权吕金梅滕媛徐凤仙解秋莉包宇旭彭金志孙维甘国友易健宏甘有为刘明陈俊宇顾鑫
Owner KUNMING UNIV OF SCI & TECH