Full-automatic tin cream printing machine capable of achieving repeated cleaning

A solder paste printing machine and multiple cleaning technology, applied in printing machines, rotary printing machines, screen printing machines, etc., can solve the problems that affect the yield, cannot be used normally, and it is difficult to rule out that the circuit board is not stained with dust, etc. Achieve the effect of improving utilization, facilitating flushing and improving efficiency

Inactive Publication Date: 2018-03-23
连江捷恒工业设计有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

"This technical solution does not clean up the circuit board to be printed, so that if the original debris on the circuit board is attached, it will not be able to be used normally even after the entire printed circuit board process is completed, which will affect the yield rate, because it is difficult for us to Exclude the circuit board from dust or attachments before being transported to the automatic solder paste printing machine

Method used

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  • Full-automatic tin cream printing machine capable of achieving repeated cleaning
  • Full-automatic tin cream printing machine capable of achieving repeated cleaning
  • Full-automatic tin cream printing machine capable of achieving repeated cleaning

Examples

Experimental program
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Effect test

Embodiment 1

[0036] Example 1, such as figure 1 Shown is an overall schematic diagram of a fully automatic solder paste printing machine with multiple cleanings, a fully automatic solder paste printing machine with multiple cleanings, including a casing, a clamping and lifting system, a platform correction system, a guide rail transportation system, and a steel mesh Frame clamping system, scraper printing system and follow-up cleaning system, which also includes pre-cleaning system, such as figure 2 As shown, the pre-cleaning system includes a splint track 1 for clamping and moving the circuit board, a first water outlet 2 for spraying water on the circuit board, a water collection bottom tank 3 for collecting water flowing through the circuit board, and In the drying part 4 of the drying circuit board, the first water outlet 2 is located above the entrance of the splint track 1, the water collection bottom tank 3 is located under the splint track 1, and the drying part 4 is located on t...

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PUM

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Abstract

The present invention provides a fully automatic solder paste printing machine with multiple cleanings, which cleans the circuit board that is about to enter the processing program, so as to improve the yield rate of the circuit board during and after printing. Platform correction system, guide rail transportation system, stencil frame clamping system, scraper printing system and subsequent cleaning system, which also includes a pre-cleaning system, the pre-cleaning system includes splint rails for clamping and moving circuit boards, The first water outlet for spraying water to the circuit board, the water collection bottom tank for collecting the water flowing through the circuit board, the drying part for drying the circuit board, and a water recovery device, the water recovery device includes a connection The water suction pump of the water collection bottom tank is used to guide water from the water suction pump to the water diversion pipe above the circuit board. There are flushing ports at the outlet of the water diversion pipe, and the flushing ports are arranged at intervals in the vertical direction A long rectangular opening extending horizontally.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a fully automatic solder paste printing machine with multiple cleanings. Background technique [0002] The application of electronic products has penetrated into all aspects of life, and people's manufacturing requirements for electronic products are getting higher and higher, because electronic products are becoming smaller and more sophisticated, and the production of printed circuit boards (PCBs) of electronic products must be produced by surface mount technology (SMT) ) equipment, the solder paste printing of the first process of production is done by the solder paste printing machine, so the processing of the first process largely determines the production quality of printed circuit boards (PCB). At present, the solder paste printing of printed circuit boards (PCBs) is mostly completed by semi-automatic solder paste printing machines or fully automatic so...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41F15/08B41F15/12B41F15/14
CPCB41F15/0818B41F15/12B41F15/14B41P2215/10B41P2235/10
Inventor 雷才俊
Owner 连江捷恒工业设计有限公司
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