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Low Dielectric Adhesive Composition

A composition and adhesive technology, applied in the direction of adhesive types, hydrocarbon copolymer adhesives, adhesives, etc., can solve the problems of low dielectric properties, poor low dielectric properties, weak adhesion, etc., Achieve low dielectric properties, excellent pot life performance, and high adhesion

Active Publication Date: 2021-06-25
TOYOBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the base film with low dielectric properties has low polarity, and when used in conventional epoxy-based adhesives or acrylic-based adhesives, the adhesive force is weak, and it is used for FPC such as cover films and laminates. Components are more difficult
In addition, the low dielectric properties of epoxy adhesives or acrylic adhesives are poor, which impairs the dielectric properties of FPC
[0004] On the other hand, polyolefin resins are known to have low dielectric properties

Method used

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  • Low Dielectric Adhesive Composition
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  • Low Dielectric Adhesive Composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0157] 500 parts by mass of main ingredient 1, 5 parts by mass of carbodiimide resin V-05 as a crosslinking agent, and 10 parts by mass of epoxy resin HP-7200 were mixed to obtain an adhesive composition. See Table 2 for mixing amount, adhesive strength, solder heat resistance, and electrical characteristics.

Embodiment 2～10

[0159] Examples 2 to 10 were carried out in the same manner as in Example 1 by changing the main ingredients 2 to 4 and the crosslinking agent to those shown in Table 2. Adhesive strength, solder heat resistance, and electrical characteristics are listed in Table 2.

[0160] [Table 2]

[0161]

manufacture example 1

[0178] In a 1L autoclave, 100 parts by mass of propylene-butene copolymer (manufactured by Mitsui Chemicals "Tafma (registered trademark) XM7080"), 150 parts by mass of toluene, 19 parts by mass of maleic anhydride, 6 parts by mass of 2-tert Butyl peroxide, after heating up to 140°C, stirred for another 3 hours. Then, after cooling the obtained reaction liquid, it inject|pours into the container which added a large amount of methyl ethyl ketones, and precipitates resin. Then, the acid-modified propylene-butene copolymer obtained by graft polymerization of maleic anhydride is separated from (poly) maleic anhydride and low molecular weight substances by centrifuging the liquid containing the resin, and purified. Then, by drying under reduced pressure at 70°C for 5 hours, a maleic anhydride-modified propylene-butene copolymer (CO-1, acid value 410 equivalents / 10 6 g, weight average molecular weight 60,000, Tm80°C, ΔH35J / g).

[0179] It can be clearly seen from Tables 1 and 2 th...

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Abstract

Provides an adhesive composition that has high adhesion not only to conventional polyimide and polyester films but also to low-polarity resin substrates such as LCP or metal substrates, and can achieve high solder heat resistance properties, and low dielectric properties, excellent pot life performance. An adhesive composition containing a solvent-soluble resin and satisfying the following (1) to (4). (1) The relative dielectric constant (ε) of the cured product of the adhesive composition at a frequency of 1 MHz c ) is 3.0 or less. (2) The dielectric loss tangent (tan δ) of the cured product of the adhesive composition at a frequency of 1 MHz is 0.02 or less. (3) The 90 degree peel strength of the laminated body which bonded together the liquid crystal polymer film and copper foil with the adhesive composition is 0.5 N / mm or more. (4) The solution viscosity ratio (solution viscosity ηB / solution viscosity ηB0) of the toluene solution (solid content concentration: 20% by mass) of the solvent-soluble resin is 0.5 or more and less than 3.0. The solution viscosity ηB0 is the solution viscosity at 25°C immediately after the solvent-soluble resin is dissolved in toluene, and the solution viscosity ηB is the solution viscosity at 25°C after the solvent-soluble resin is dissolved in toluene and stored at 5°C for 7 days.

Description

technical field [0001] The present invention relates to adhesive compositions exhibiting low dielectric constant, low dielectric loss tangent. More specifically, it relates to an adhesive composition for bonding a resin substrate and a resin substrate or a metal substrate. In particular, it is related with the adhesive composition for flexible printed circuit boards (hereinafter abbreviated as FPC), and the coverlay film, laminated board, resin-coated copper foil, and an adhesive sheet containing the same. Background technique [0002] In recent years, as the speed of transmission signals on printed circuit boards has increased, the frequency of signals has been increased. At the same time, in FPC, there is an increasing demand for low dielectric properties (low dielectric constant, low dielectric loss tangent) in the high frequency range. In response to such requirements, as the base film used in FPC, it was proposed to use liquid crystal polymer (LCP), syndiotactic polys...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J201/00C09J179/00C09J7/30C09J125/06C09J125/10C09J163/00
CPCC09J125/04C09J163/00C09J179/00C09J201/00B32B7/12B32B2457/08C09J7/00C09J125/06C09J125/10
Inventor 三上忠彦伊藤武薗田辽
Owner TOYOBO CO LTD