A self-optimizing flash spray cooling system for electronic devices

Abstract

The invention discloses a self-optimizing flash spray circulation cooling system for electronic devices, which includes a compressor, a condenser, a regenerator, a liquid storage tank, a spray chamber and a gas-liquid separator; the outlet of the compressor passes through a pipeline and the condenser The inlet of the condenser is connected to the inlet of the first channel of the regenerator through a pipeline, the outlet of the first channel of the regenerator is connected to the inlet of the liquid storage tank through a pipeline, and the lower outlet of the liquid storage tank is connected to the inlet of the spray chamber through a pipeline The lower liquid outlet of the spray chamber is connected to the inlet of the second channel of the regenerator through a pipeline; the upper gas outlet of the spray chamber is connected to the inlet of the gas-liquid separator through a pipeline, and the outlet of the second channel of the regenerator is connected through a pipeline It is connected with the inlet of the gas-liquid separator, and the gas-liquid separator is connected with the inlet of the compressor through a pipeline. By adjusting parameters such as bypass valve opening, compressor frequency, spray height and inclination angle, the system realizes optimal control of heat exchange strength and ensures rapid and stable system.

Description

technical field [0001] The invention belongs to the technical field of refrigeration, and in particular relates to an electronic device / chip flash spray circulation cooling system. Background technique [0002] Chip technologies such as CPU chips, laser semiconductor chips, LED chips, and electronic devices such as laser weapons and active phased array radars have developed towards high integration and high power in recent years. Take the LED chip as an example, only 20%-30% of the electric energy is converted into light energy when it is working, and the remaining 70%-80% of the electric energy is converted into heat energy. Poor heat dissipation will cause the junction temperature of the chip to rise, resulting in spectral Offset, life reduction and other issues. Similarly, for the CPU chip, if it exceeds 60°C, the possibility of chip burnout increases greatly. According to investigations, 60%-70% of CPU chip damage is related to excessive temperature. For high-power chi...

AI Technical Summary

Problems solved by technology

[0005] However, most of the current flash spray cooling devices are open design, resulting in the waste of refrigerant and pollution to the environment; the rare closed circulation system does not effectively solve the problem of system operation stability, limited heat dissipation capacity, and compressor Mismatch with the nozzle flow rate, spray distance and spray chamber inclination angle have a significant impact on the cooling effect

Images