A comprehensive heat exchange device based on conduction

Abstract

The invention proposes a conduction-based integrated heat exchange device. Electronic devices in equipment are classified and respectively processed according to sizes of hot flow density. The devicecomprises a low-power consumption hot source cooling structure, a high-power consumption hot source cooling structure, a printed circuit board (PCB) hot source heat conduction structure and a concentrated heat exchange module, wherein the low-power consumption hot source cooling structure is used for cooling a hot source with small hot flow density in the equipment and is arranged on a wall surface of the equipment, the high-power consumption hot source cooling structure is used for cooling a hot source with large hot flow density in the equipment, the PCB hot source heat conduction structureis used for conducting a hot source on a PCB to an inner surface of the concentrated heat exchange module, and the concentrated heat exchange module is used for receiving heat conducted by the high-power consumption hot source cooling structure and the PCB heat conduction structure and dissipating the heat in a concentrated way. By the device, the equipment complexity is reduced, and the device islow in cooling cost and good in maintainability.

Description

technical field [0001] The invention belongs to the technical field of electronic equipment structure design, and relates to a comprehensive heat exchange device for a high heat flux density electronic equipment system, in particular to a heat dissipation structure design for an airtight electronic equipment with a total heating power of components reaching 1010W. The electronic equipment is a marine For marine outboard equipment in the environment, the ambient temperature can reach 65°C, and the maximum operating temperature of electronic components is 80°C. Background technique [0002] The heat source in the equipment box is divided into two structural forms: block heat source and PCB (printed circuit board) heat source. The maximum heat flux density of block heat source reaches 0.675W / cm 2 , PCB local maximum heat flux up to 2.1W / cm 2 . When the temperature rises to 40°C, the maximum surface heat flux density that can be handled by various heat dissipation methods obt...

AI Technical Summary

Problems solved by technology

[0006] (1) The structure of the cold plate, joints, and liquid supply devices required by the liquid cooling method is complex, expensive, and costly

[0007] (2) The anti-corrosion performance of air-conditioning equipment is poor, and it is prone to moisture and corrosion in marine environments;

[0008] (3) The operating environment of the equipment is harsh, the shaking and tremors are serious, the air conditioner is easily damaged, and the reliability and maintainability are poor;

[0009] Regardless of the liquid cooling method or the cooling method of an external air conditioner, external equipment needs to be added, which increases the weight and volume of the equipment

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