NXN fine pitch array collimator

Abstract

The invention relates to a collimator and a preparation method, belongs to the technical field of optical communication, and particularly relates to a two-dimensional array collimator and a preparation method. A one-dimensional fiber array and a one-dimensional lens array which has mature processes are used as raw materials to carry out coupling and packing of the two-dimensional array collimator,the cost of the raw materials is low, and control precision of gaps among various units is high. After the consistency of focal lengths of various layers of fiber arrays are debugged independently relative to various layers of lens arrays, the fiber arrays and the lens arrays are stacked and connected in an adhered manner; after the linearity consistency of the various lens arrays is independently debugged relative to the various fiber arrays, the various lens arrays are fixed on a lens array fixing frame in an adhered manner; and direction consistency, light spot consistency and high-precision control over insertion loss indexes of the overall two-dimensional array collimator can be ensured. Because the whole row of lens arrays and fiber arrays are coupled and packaged, the efficiency ishigh, and the structure is compact and stable.

Description

technical field [0001] The invention relates to a collimator, which belongs to the technical field of optical communication, in particular to a micro-pitch array collimator. Background technique [0002] Due to the continuous and rapid development of the Internet, the communication capacity of optical networks continues to increase, and the requirements for the integration density of optical devices are getting higher and higher. The traditional optical device assembly and combination scheme is used to achieve integration, the device size is large, the energy consumption is high, and multiple splicing leads to poor long-term use stability of the device, and the cost of manpower and material resources is very high; the integration solution realized by silicon-based chip technology, the device size It is extremely small and has high structural stability. However, due to its high technical requirements, it is still far away from commercialization; the collimator is a basic devi...

AI Technical Summary

Problems solved by technology

The traditional optical device assembly and combination scheme is used to achieve integration, the device size is large, the energy consumption is high, and multiple splicing leads to poor long-term use stability of the device, and the cost of manpower and material resources is very high; the integration solution realized by silicon-based chip technology, the device size It is extremely small and has high structural stability. However, due to its high technical requirements, it is still far away from commercialization; the collimator is a basic device in optical communication and is widely used in optical switches, optical isolators, and optical rings. In devices and optical dense wavelength division multiplexers, the array collimated beams formed by the array collimator are used to inject and receive optical signals in batches, and only a device core with a slightly larger size is inserted, which is packaged with the array collimator , which can make the device achieve several 10 times higher integration. This kind of integration technology is mature, the device has high stability, low cost and small size;

[0003] At present, the existing array collimator technical solutions are divided into the following types: collimator splicing scheme, using multiple individual collimators packaged in a glass plate in a certain arrangement structure to form a one-dimensional collimator array, which is limited by the size of the components Limitations, this kind of scheme has large collimator spacing and unstable packaging state, which requires more manpower and material costs; one-dimensional fiber array and lens array scheme: use one-dimensional fiber array and one-dimensional lens array to achieve packaging through a certain structural process , the formed one-dimensional array collimator has stable packaging state and high spacing density, but limited to coupling packaging technology, only one-dimensional low-density integration can be realized; two-dimensional array optical fiber and two-dimensional array lens scheme: adopt high-precision two-dimensional The two-dimensional fiber array and the two-dimensional array lens are directly coupled and packaged to form a two-dimensional array collimator, which has a high degree of integration and a simple and stable structure. However, in order to ensure that the overall insertion loss is less than 1.0dB, the positioning accuracy of the two-dimensional fiber array and the two-dimensional lens array requires Less than 0.5um, the cost of raw materials is extremely high, and it is difficult to commercialize; the solution of two-dimensional optical fiber and two-dimensional lens array with a two-dimensional correction unit: after direct coupling and packaging of a lower-precision two-dimensional optical fiber array and a two-dimensional lens array, the output At the end, a two-dimensional correction unit is used to correct the parallelism of each beam, and finally a two-dimensional collimator beam array with a higher parallelism is formed. The cost of this solution is low, but the size of the correction unit is large, and the distance between the collimators cannot be too small , and the stability of multiple correction units individually packaged devices is poor

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