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Lining machining method

A processing method and substrate technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of increasing the removal amount of the substrate itself during polishing, increasing the difficulty of polishing, and increasing processing costs, so as to reduce production. cost, avoid waste, and improve production efficiency

Inactive Publication Date: 2018-05-04
紫石能源有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

However, the grinding process will also add a new damaged layer, which increases the difficulty of subsequent polishing, that is, increases the polishing time and the removal amount of the substrate itself, resulting in an increase in processing costs.

Method used

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Embodiment Construction

[0031] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0032] Such as figure 1 As shown, the embodiment of the present invention provides a substrate processing method, which includes the following steps:

[0033] S100, performing edge grinding on the sliced ​​substrate, so as to reduce the roughness of the edge of the substrate. Wherein, during slicing, specifically, the substrate may be cut into thin slices of preset thickness through a cutting line reciprocating at high speed on a cutting machine.

[0034] S200. Putting the substrate after the edge grinding process into an etching proce...

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Abstract

The invention discloses a lining machining method. The lining machining method comprises the steps of conducting edge polishing on a lining obtained through slicing to lower the roughness of the edgeof the lining; making the lining after being subjected to an edge polishing working procedure enter a corrosion working procedure to remove a first part of a damage layer generated by a slicing working procedure; polishing the lining subjected to the corrosion working procedure to remove a second part of the damage layer. By means of the lining machining method, a grinding working procedure is omitted, the corrosion working procedure is executed simply after the lining is subjected to the slicing working procedure and the edge polishing procedure, in this way, the damage layer generated by theslicing working procedure can be directly removed, a new damage layer cannot be generated, accordingly, material waste is avoided, the production cost of the lining is lowered, the technology steps are also reduced, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a substrate processing method. Background technique [0002] Gallium arsenide, sapphire, silicon wafer and other substrates are widely used in semiconductor fields such as high frequency and wireless communication, photoluminescence and solar cell power generation. [0003] At present, the production process of these substrates used in the market is complicated and the cost is high. How to further reduce the processing cost of the substrate has become the goal that everyone is scrambling to pursue. [0004] In the prior art, the substrate needs to go through a grinding process during the processing to remove the damaged layer caused by the previous process. However, the grinding process will also add a new damaged layer, thereby increasing the difficulty of subsequent polishing, that is, increasing the polishing time and the removal amount of the substrate itself, resulti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/306
Inventor 刘桂勇兰立广宋士佳
Owner 紫石能源有限公司
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