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Polybenzoxazole and Its Utilization

A technology of polybenzoxazole and precursor, applied in the field of polybenzoxazole and its utilization, can solve problems such as unfavorable manufacturing cost, complicated manufacturing engineering, lack of gas barrier properties and the like

Active Publication Date: 2020-11-17
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in these technologies, a polyimide resin lacking in gas barrier properties is used as the main component, so in order to improve the gas barrier properties, other inorganic components other than the resin component are required, and the manufacturing process becomes complicated. Also disadvantageous in terms of manufacturing costs

Method used

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  • Polybenzoxazole and Its Utilization
  • Polybenzoxazole and Its Utilization
  • Polybenzoxazole and Its Utilization

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0097] The following examples are given to describe the present invention more specifically, but the present invention is not limited to the following examples. In addition, the apparatuses used are as follows.

[0098] (1)FT-IR

[0099] Device: Made by Thermo Fisher Scientific Inc., NEXUS 670FTIR

[0100] (2) Molecular weight measurement: Manufactured by Showa Denko Co., Ltd., normal temperature gel permeation chromatography (GPC) apparatus (GPC-101) and column (KD-803L) made by Shodex

[0101] (measurement conditions)

[0102] Column temperature: 40°C

[0103] Eluent: Dimethylformamide (DMF), 10mL / L

[0104] Flow rate: 1.0mL / min

[0105]Standard sample for calibration curve creation: Showa Denko Co., Ltd., SL-105, standard polystyrene (molecular weight: about 580, 2970, 7200, 19900, 52400)

[0106] (3) Film thickness measurement: Micro shape measuring machine Surfcorder ET-4000 manufactured by Kosaka Laboratories Co., Ltd.

[0107] (4) Water vapor transmission rate: s...

manufacture example 1

[0118] Dissolve PDA20.261g (0.1875mol) and DATP12.206g (0.0469mol) in NMP617.4g, after cooling to 15°C, add PMDA50.112g (0.2298mol), and make it react at 50°C under nitrogen atmosphere for 48 Hour. The weight average molecular weight Mw of the obtained polymer was 82100, and the molecular weight distribution was 2.7. This polyamic acid was apply|coated on the glass substrate with the bar coater. This substrate was baked on a hot plate at 80° C. for 30 minutes, and further baked in an oven at 450° C. for 1 hour after depressurizing to obtain a polyimide-attached glass substrate with a film thickness of 11 μm.

[0119] [2] Production of polybenzoxazole precursor (film-forming composition)

Embodiment 1-1

[0120] [Example 1-1] Production of precursor [3]

[0121] [chemical 10]

[0122]

[0123] AHPE[2]0.851g (3.66mmol) was dissolved in NMP18g, and CBOCCl[1]1.149g (3.59mmol) was added, and it stirred at room temperature for 24 hours. Then, the obtained solution was poured into 500 mL of pure water. The obtained precipitate was separated by filtration, and then dried under reduced pressure at 80° C. for 24 hours to obtain the target precursor [3] (95% yield). The obtained precursor [3] had a weight average molecular weight Mw of 142,000 and a molecular weight distribution of 8.8. In addition, by FTIR measurement, it was confirmed that the 3300 cm from the phenolic hydroxyl group -1 and the peak from the amido group at 1651 cm -1 peak.

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Abstract

The present invention provides a polymer and its use, which alone can give a film with good water vapor barrier properties without using an inorganic component. Polybenzoxazole is characterized by being represented by formula (2). (where, R 1 ~R 13 Each independently represents a hydrogen atom, a halogen atom, a nitro group, a cyano group, or an alkyl group with 1 to 20 carbons, an alkenyl group with 2 to 20 carbons, and an alkynyl group with 2 to 20 carbons that may be substituted by a halogen atom , an aryl group having 6 to 20 carbons or a heteroaryl group having 2 to 20 carbons, n represents an integer of 2 or more. )

Description

technical field [0001] The present invention relates to polybenzoxazole and its utilization. Background technique [0002] In recent years, with the development of electronic devices, their weight reduction and miniaturization have been realized. In its assembly, an attempt has been made to use a lighter and more flexible resin substrate instead of a conventionally used glass substrate. [0003] However, resin substrates often have lower gas barrier properties such as water vapor than glass substrates. Therefore, for the practical use of resin substrates in electronic devices, one of the problems to be solved is to secure gas barrier properties against water vapor and the like that enter the device and adversely affect electronic circuits, device components, and the like. [0004] As means for solving such problems, for example, a technique of using a composition containing polyimide and an organic phyllosilicate, and a technique of forming a silicon oxide thin film as a b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/22B32B27/00B32B27/40
CPCB32B27/00B32B27/40C08G73/22C08J5/18C09D179/06H10K50/844
Inventor 江原和也进藤和也
Owner NISSAN CHEM IND LTD