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A radiator for high-power LED lamps

A technology of LED lamps and radiators, which is applied to semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, lighting and heating equipment, etc., can solve the problem of high cost of heat pipe heat dissipation, increased processing cost of heat sinks, and low reliability. and other problems, to achieve the effect of facilitating large-scale promotion and application, avoiding light decay and life reduction, and high heat dissipation efficiency

Active Publication Date: 2019-12-20
绍兴立德金属制品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the heat dissipation methods of LED lamps are mainly natural convection heat dissipation, forced heat dissipation by adding fans, heat pipe heat dissipation, etc. The heat dissipation system of adding fans is complicated, the reliability is low, and the cost of heat pipe heat dissipation is relatively high. Therefore, natural heat dissipation is generally used in the existing technology Convection is used to dissipate heat. By increasing the surface area of ​​the radiator, convection is used to improve the heat dissipation effect. However, this way of increasing the heat dissipation area is limited by the process. The more the surface area of ​​the radiator is increased, the more difficult it is to manufacture the process. The larger the heat sink, the higher the processing cost of the heat sink
[0004] For high-power LED lamps, it is necessary to ensure a sufficient number of heat dissipation fins to meet the heat dissipation requirements. In the prior art, heat dissipation fins are easy to fall off, which affects the heat dissipation performance of the radiator

Method used

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  • A radiator for high-power LED lamps
  • A radiator for high-power LED lamps
  • A radiator for high-power LED lamps

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] In this embodiment, the composition of the thermally conductive glue includes:

[0041] 100 parts epoxy resin

[0042] Aluminum oxide (particle size is 8μm) 16 parts

[0043] Silane coupling agent KH-550 2 parts

[0044] Curing agent dicyandiamide 6 parts

[0045] carbon fiber 3 parts

[0046] Acetone 120 parts.

Embodiment 2

[0048] In this embodiment, the composition of the thermally conductive glue includes:

[0049] 85 parts of epoxy resin

[0050] Zinc oxide (particle size is 3μm) 12 parts

[0051] Silane coupling agent KH-550 0.2 parts

[0052] Curing agent phenolic 1 part

[0053] carbon fiber 2 parts

[0054] 90 parts of dichloromethane.

Embodiment 3

[0056] In this embodiment, the composition of the thermally conductive glue includes:

[0057] 110 parts of epoxy resin

[0058] Aluminum nitride (particle size is 15μm) 20 parts

[0059] Silane coupling agent KH-550 3 parts

[0060] Curing agent diaminodiphenyl sulfone 10 parts

[0061] carbon fiber 5 parts

[0062] 135 parts of triethyl phosphate.

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Abstract

The invention belongs to the technical field of LED lamp assemblies and particularly relates to a heat dissipater for a large-power LED lamp. The heat dissipater comprises a tubular heat dissipater body, the end, close to the LED lamp, of the heat dissipater body is provided with an annular groove, and a metal piece is inserted into the annular groove. The periphery body of the outer side of the other end of the heat dissipater body is provided with a thread and a groove formed in the length direction of the heat dissipater body, the groove extends from the end, provided with the thread, of the heat dissipater body to the side, where the LED lamp is located, of the heat dissipater body, and the length of the groove is smaller than that of the heat dissipater body. Heat dissipating fins areinserted into the groove, the outer side faces of the heat dissipating fins close to the end where the thread is arranged are flush with a groove opening of the groove, and a clamp cover is arrangedat the end of the heat dissipater body and connected with the heat dissipater body in a threaded mode. According to the heat dissipater, the heat dissipater for the LED lamp is designed in a split mode, heat dissipating used materials are allowed to be selected specifically so as to meet the heat dissipation of different requirements, and the heat dissipater for the LED lamp is simple in structureand convenient to manufacture, and application and popularization on a large scale are facilitated.

Description

technical field [0001] The invention belongs to the technical field of LED lamp components, and in particular relates to a radiator for high-power LED lamps. Background technique [0002] LED, Light Emitting Diode, is a solid-state semiconductor device that converts electrical energy into visible light. LED lamps have the characteristics of long life, energy saving, and environmental protection, and are gradually replacing ordinary fluorescent lamps. LED lamps will generate a lot of heat when they are working. If they cannot be dissipated in time, it will cause the light decay of the LED chip and reduce the service life of the LED lamp. In order to quickly dissipate the heat generated by the LED lamp when it is working, the general LED lamp will be equipped with a radiator. [0003] At present, the heat dissipation methods of LED lamps are mainly natural convection heat dissipation, forced heat dissipation by adding fans, heat pipe heat dissipation, etc. The heat dissipati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21V29/76F21V29/87F21V29/89F21Y115/10
CPCF21V29/763F21V29/87F21V29/89F21Y2115/10
Inventor 曹结宾
Owner 绍兴立德金属制品有限公司