A radiator for high-power LED lamps
A technology of LED lamps and radiators, which is applied to semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, lighting and heating equipment, etc., can solve the problem of high cost of heat pipe heat dissipation, increased processing cost of heat sinks, and low reliability. and other problems, to achieve the effect of facilitating large-scale promotion and application, avoiding light decay and life reduction, and high heat dissipation efficiency
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Embodiment 1
[0040] In this embodiment, the composition of the thermally conductive glue includes:
[0041] 100 parts epoxy resin
[0042] Aluminum oxide (particle size is 8μm) 16 parts
[0043] Silane coupling agent KH-550 2 parts
[0044] Curing agent dicyandiamide 6 parts
[0045] carbon fiber 3 parts
[0046] Acetone 120 parts.
Embodiment 2
[0048] In this embodiment, the composition of the thermally conductive glue includes:
[0049] 85 parts of epoxy resin
[0050] Zinc oxide (particle size is 3μm) 12 parts
[0051] Silane coupling agent KH-550 0.2 parts
[0052] Curing agent phenolic 1 part
[0053] carbon fiber 2 parts
[0054] 90 parts of dichloromethane.
Embodiment 3
[0056] In this embodiment, the composition of the thermally conductive glue includes:
[0057] 110 parts of epoxy resin
[0058] Aluminum nitride (particle size is 15μm) 20 parts
[0059] Silane coupling agent KH-550 3 parts
[0060] Curing agent diaminodiphenyl sulfone 10 parts
[0061] carbon fiber 5 parts
[0062] 135 parts of triethyl phosphate.
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