Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method of forming sound vortex based on patterned tailoring technology

A patterned and vortex technology, applied in the field of acoustic waves, can solve the problems of large acoustic vortex devices, limited application range, and limited precision, and achieve the effects of size reduction, broad application prospects, and high energy utilization.

Active Publication Date: 2018-05-22
HUAZHONG UNIV OF SCI & TECH
View PDF14 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above defects or improvement needs of the prior art, the present invention provides a method for forming an acoustic vortex based on patterned cutting technology, thereby solving the problem that the existing devices for generating acoustic vortex are very bulky and heavy, and the cost is also high, and the limitation Its scope of application is limited, and technical problems such as limited precision

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method of forming sound vortex based on patterned tailoring technology
  • Method of forming sound vortex based on patterned tailoring technology
  • Method of forming sound vortex based on patterned tailoring technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] Evenly mix copper particles with a diameter of 0.5 microns to 1.5 microns and polyvinyl alcohol (model: PVA124) aqueous solution. Need specific adjustments.

[0072] Wherein, the concentration of the polyvinyl alcohol solution in the embodiment of the present invention may also be other concentration with relatively stable dissolution.

[0073] In the embodiment of the present invention, copper particles: polyvinyl alcohol are given in four situations of 1:1, 1:2, 1:4, and 1:8. Using the mixed solution as a raw material, electrostatic spinning fibers with particles with a diameter of 0.5 micron to 1.5 micron can be obtained, and the electrostatic spinning film is formed by stacking the electrospinning fibers.

[0074] According to the mixed liquids with different mass ratios of copper particles and polyvinyl alcohol configured according to the present invention, after obtaining a uniformly mixed copper particle / polyvinyl alcohol mixed liquid, this can be used as a raw ...

Embodiment 2

[0076] Evenly mix lead oxide particles with a diameter of 0.5 microns to 1.5 microns and polyacrylonitrile (PAN) in dimethylformamide (DMF) solution (PAN is insoluble in water, soluble in organic solvents such as DMF, etc.), and the polyacrylonitrile used The concentration of the DMF solution is 8% to 12%, and the mass ratio of lead oxide particles and polyacrylonitrile is specifically adjusted according to actual needs.

[0077] Wherein, the concentration of the polyacrylonitrile solution in the embodiment of the present invention may also be other concentration with relatively stable dissolution.

[0078] In the embodiment of the present invention, lead oxide particles: polyacrylonitrile are given in four situations of 1:1, 1:4, 1:8, and 1:16. Using the mixed solution as a raw material, electrostatic spinning fibers with particles with a diameter of 0.5 micron to 1.5 micron can be obtained, and the electrostatic spinning film is formed by stacking the electrospinning fibers....

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a method of forming sound vortex based on a patterned tailoring technology. The method comprises steps: a phase regulation thin film is determined, wherein the phase regulationthin film can change the phase of transmitted sound waves by 180 degrees; and the phase regulation thin film is tailored to have a Fermat spiral pattern, and the sound waves transmitted through the tailored phase regulation thin film can generate stable-propagation sound vortex. The stable sound vortex can be generated, the sound vortex can be propagated stably within a certain distance of a transmission field, the central intensity of the vortex is 0, the sound vortex can be obtained through the thin film and through controlling the tailored pattern, the obtained sound vortex can be used inaspects such as noise isolation, sound communication and particle manipulation, and the application prospect is wide.

Description

technical field [0001] The invention belongs to the field of acoustic wave technology, and more specifically relates to a method for forming an acoustic vortex based on patterned cutting technology. Background technique [0002] Acoustic vortex is of great significance for particle rotation manipulation, acoustic communication, etc. and has great practical value in production and life. Acoustic vortex is similar to optical vortex and natural vortex phenomena such as tornado, etc., which is a relatively frontier research. [0003] In the existing literature, methods for generating vortex include active phased array method and passive waveguide cavity stacking. Its realization method is to make the phase elements at different positions on the plane have different phases, so that the initial phase in the plane around the center of the circle changes uniformly by 360 degrees to generate the acoustic vortex. The active phased array uses current to control the delayed phase; whi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G10K11/26G10K11/30G10K11/36D04H1/728D06H7/00
CPCD04H1/728D06H7/00G10K11/26G10K11/30G10K11/36
Inventor 臧剑锋唐瀚川祝雪丰喻研叶镭
Owner HUAZHONG UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products