235 results about "Noise isolation" patented technology

An audio headphone apparatus having ambient noise isolation properties for musicians and sound engineers which allows a user to substantially attenuate ambient noise levels and focus on the electronic audio presented to the headphones. The apparatus utilizes a unique layering of absorber materials with unique geometric shapes which in combination highly attenuate external ambient acoustic energy and control undesirable “boomy” bass response. The apparatus further utilizes a desiccant material within the ear cuff cover which helps to absorb perspiration or other moisture.

An integration assembly for a battery pack mounted between the passenger cabin floor panel of an electric vehicle and the driving surface is provided, the assembly utilizing a multi-layer thermal barrier interposed between the battery pack enclosure and the passenger cabin floor panel, where the multi-layer thermal barrier provides noise isolation, thermal isolation and vibration damping, and where the multi-layer thermal barrier is compressed when the battery pack enclosure is mounted to the vehicle. The multi-layer thermal barrier is comprised of a first layer formed from a compressible and conformable elastic material and a second layer formed from a conformable thermally insulating material. The multi-layer thermal barrier may also include a moisture barrier layer that encases the first and second layers, for example a moisture barrier layer fabricated from a plastic. A sealant may be used to seal and bond the moisture barrier layer to the battery pack enclosure.

A system and method decreases the transmission of structure-borne noise by cooling fans to electronic components and structurally integrated enclosures for the electronic components. The system has a machined isolation plate that fits onto a rear plate on the structurally integrated enclosure. The cooling fans are fitted onto the opposite side of the isolation plate. Fitted between the isolation plate and the rear plate, and / or the isolation plate and the cooling fans are soft elastomeric isolators. These isolators dampen and prevent the transmission of structure-borne noise from the cooling fans to the electronic components and the structurally integrated enclosure. This dampening is advantageous on platforms in which stealth is desired, such as on submarines.

An improved integration system for a battery pack mounted between the passenger cabin floor panel of an electric vehicle and the driving surface is provided, the system utilizing at least one insulating layer interposed between the battery pack enclosure and the passenger cabin floor panel, where the insulating layer provides noise isolation, thermal isolation and vibration damping, and where the insulating layer is compressed when the battery pack enclosure is mounted to the vehicle.

An integration assembly for a battery pack mounted between the passenger cabin floor panel of an electric vehicle and the driving surface is provided, the assembly utilizing a multi-layer thermal barrier interposed between the battery pack enclosure and the passenger cabin floor panel, where the multi-layer thermal barrier provides noise isolation, thermal isolation and vibration damping, and where the multi-layer thermal barrier is compressed when the battery pack enclosure is mounted to the vehicle. The multi-layer thermal barrier is comprised of a first layer formed from a compressible and conformable elastic material and a second layer formed from a conformable thermally insulating material. The multi-layer thermal barrier may also include a moisture barrier layer that encases the first and second layers, for example a moisture barrier layer fabricated from a plastic. A sealant may be used to seal and bond the moisture barrier layer to the battery pack enclosure.

A system-on chip (SOC) (100) and method of isolating noise in a SOC, including a plurality of noise sensitive circuit blocks (120, 220) and ESD protected pads (302, 304, 306, 308, 310, 312, and 314). A VDD isolation pad (302) is connected to an N well ring (124) of the first noise sensitive circuit (120) to collect noise from the substrate (110) and isolate the circuit from the P well region (112). A ground protected pad (304) is connected to an isolated P well (126) of a first noise sensitive circuit (120). The ground pad (304) collects noise from the isolated P well (126) and sends it to ground. A dedicated ground isolation pad (306) is connected to a P well ring (224) of a second noise sensitive circuit (220). The dedicated ground isolation pad (306) collects noise from the P well ring (224) and sends it to ground. The dedicated ground isolation pad (306) and the ground pad (304) collect noise that would normally propagate between the first and second noise sensitive circuits (120, 220) and additional circuits that share the same substrate (110).

The invention belongs to the technical field of building materials, in particular relates to foam concrete with desulfurized gypsum as a main cementing material. The foam concrete comprises desulfurized gypsum, slag powder, coal ash, cement, a foaming agent, a foam stabilizer, an alkali-activator, an early strength agent, water glass, a water reducer and polypropylene fibre. The desulfurized gypsum in the foam concrete is uncalcined desulfurized gypsum; by using the foam concrete, the desulfurized gypsum can be recycled, a great number of industrial wastes such as slag powder and coal ash canbe digested, and a favorable environmental benefit is achieved. In addition, the foam concrete provided by the invention has the excellent performances such as light weight, heat insulation, noise isolation and absorption, flame retardance, seismic resistance and energy adsorption, can be used for casting in situ and producing blocks and plates and is suitable for casting a roof heat insulating layer, a floor heating heat insulating layer, a light wall heat insulating building block, a road absorbent lined barrier and the like in situ.

The invention relates to noise isolation in semiconductor devices, and a design structure on which a subject circuit resides. A design structure is embodied in a machine readable medium used in a design process. The design structure includes a deep sub-collector located in a first epitaxial layer, and a doped region located in a second epitaxial layer, which is above the first epitaxial layer. The design structure further includes a reach-through structure penetrating from a surface of the device through the first and second epitaxial layers to the deep sub-collector, and a trench isolation structure penetrating from a surface of the device and surrounding the doped region.

There is provided a noise isolation sheet 10 which is comprised of an optional number of closed-cell foamed layer 11, open-cell foamed layer 12 and fibered noise absorbing material 13, being laminated in an optional order, and which insulates the noise near 1000 Hz. Further, there is provided a noise isolation sheet 10 comprised of an optional number of the closed-cell foamed layer 11 and the fibered noise absorbing material 13 being laminated in an optional order. There is also provided a noise isolation sheet 10 comprised of an optional number of the open-cell foamed layer 12 and the fibered noise absorbing material 13 being laminated in an optional order. Each noise isolation sheet 10 is used to partially or fully cover an interior side of a door inner panel of a vehicle.

A noise-reducing substrate for use in a flooring system, the flooring system having a subfloor and a decorative upper layer. The substrate comprises a series of edge butted panels, each of which has a bottom surface, a top surface and side surfaces. Each panel's top surface and oppositely facing bottom surface are parallel to each other and are spaced apart by the thickness of the substrate. A profile in the bottom surface of the substrate changes the substrate's effective stiffness and improves the noise isolation of the substrate compared to the stiffness and noise isolation of the panel without the profile. Additionally, the profile reduces the weight of the panel, thereby reducing manufacturing and installation costs. When the substrate is positioned between the subfloor and the decorative top layer, the material hardness and the flat profile of the upper surface provide a platform with the strength and texture required to allow for installation of the decorative floor layer without the need for an additional rigid backing material. Such a system greatly improves the impact noise reduction on a variety of floor / ceiling systems while keeping the installation cost low and the adding very little to the total system thickness.

The invention discloses an automatic switching circuit of a power supply, which comprises a first power input terminal, a second power input terminal, a switching module and an output terminal, wherein the first power input terminal adopts local direct current power supply input, one path thereof is directly connected with the output terminal, and the other path thereof is connected with a first input terminal of the switching module; the second power input terminal is connected with a second input terminal of the switching module, the output of the switching module is connected with the output terminal, and when input is conducted at the first power input terminal, the switching module does not have output. The priority of the output of the first power input terminal is higher than that of the second power input terminal; the automatic switching circuit is not limited to the switching selection between a local power supply and a POE power supply, and can be extended to similar occasions with the problem of switching selection of two paths of power supplies so as to realize automatic switching between two power supplies; and the automatic switching circuit is simple and practical, has low cost and high reliability, and also has the functions of power supply voltage electrifying buffering, overcurrent protection, anti-inversed connection protection, filtering, noise isolation and the like.

A direct conversion radio frequency (RF) transceiver integrated circuit (IC) is provided. The IC includes a local oscillator block, a receiver block, and a transmitter block disposed on a single silicon-based integrated circuit. Each of such blocks are connected to a ground plane that includes a metal located adjacent to each of such blocks, air gaps located between each section of the metal adjacent to such blocks, each section of the metal being connected to the adjacent section of metal in the group plane at a location on the edge of the ground plan corresponding to a point substantially equidistant from the two sections of metal. A system and method is provided for implementing a direct conversion integrated circuit architecture. A clock distribution system is provided, as well as a method for radio detection and ranging (RADAR) using a Doppler RADAR transceiver system in the W-band. A method for noise isolation between blocks of an integrated circuit is also provided.

The present invention provides an implantable medical device having at least two electrodes coupled to the device housing. The electrodes may be configured for sensing physiological signals such as cardiac signals and alternatively for providing an electrical stimulation therapy such as a pacing or defibrillation therapy. In accordance with aspects of the disclosure, the device housing provides a hermetic enclosure that includes a battery case hermetically coupled to a circuit assembly case. At least one of the at least two electrodes is coupled to an exterior surface of the battery case. The battery case is electrically insulated from the cathode and anode of the battery.

There is provided an insert ear bud earphone with variable noise isolation. The earphone includes a housing with a serpentine channel which is able to contain at least one transducer in a main body of the housing; and a cushion which contacts a user's ear canal wall, the cushion being mounted on the serpentine channel. There is preferably at least one opening in either the housing or the cushion which causes leakage and allows ambient noise to enter the user's ear canal. There is also provided a cushion for an insert ear bud earphone. Finally, there is provided a method to enable variable noise isolation in an insert ear bud earphone comprising an inclusion of at least one opening in either a housing of the earphone or a cushion mounted on the earphone which causes leakage and allows ambient noise to enter a user's ear canal.

A noise isolation device includes a plurality of panels comprising a sound absorbent material for assembling into an enclosure for a pump mechanism and a plurality of fasteners built into the panels for assembling the panels to form an enclosure for a pump mechanism and for disassembling the panels to remove the enclosure from the pump mechanism.

Improved noise isolation for high-speed digital systems on packages and printed circuit boards is provided by the use of mixed alternating impedance electromagnetic bandgap (AI-EBG) structures and a power island configured to provide ultimate noise isolation. A power island is surrounded by a plurality of mixed AI-EBG structures to provide a power distribution network. In this structure, the gap around the power island provides excellent isolation from DC to the first cavity resonant frequency which is determined by the size of the structure and dielectric material. One AI-EBG structure provides excellent isolation from the first cavity resonant frequency of around 1.5 GHz to 5 GHz. The other AI-EBG structure provides excellent noise isolation from 5 GHz to 10 GHz. Through use of this novel configuration of AI-EBG structures, a combination effect of the hybrid AI-EBG structure provides excellent isolation far in excess of 10 GHz. The AI-EBG structure is a metallic-dielectric EBG structure that comprises two metal layers separated by a thin dielectric material (similar to power / ground planes in packages and PCBs). However, in the AI-EBG structure, only one of the metal layers has a periodic pattern which is preferably a two-dimensional rectangular lattice with each element consisting of a metal patch with four connecting metal branches.

An audio headphone apparatus having ambient noise isolation properties for musicians and sound engineers which allows a user to substantially attenuate ambient noise levels and focus on the electronic audio presented to the headphones. The apparatus utilizes a unique layering of absorber materials with unique geometric shapes which in combination highly attenuate external ambient acoustic energy and control undesirable “boomy” bass response. The apparatus further has a jack adapter holder which retains a ¼ inch adapter for use with an external plug on the headphones.

A noise-reducing substrate for use in a flooring system which ha a subfloor and a floating floor upper layer. The substrate comprises a series of edge butted panels, each having a bottom surface, a top surface and side surfaces. A profile in the bottom surface of the substrate changes the substrate's effective stiffness improving the noise isolation of the substrate compared to the stiffness and noise isolation of the panel without the profile. Additionally, the profile reduces the weight of the panel, thereby reducing manufacturing and installation costs. Material hardness and profile flatness of the upper surface provide the strength and texture required to allow for installation of the floating floor layer without the need for an additional rigid backing material. Such a system greatly improves the impact noise reduction on floor / ceiling systems while keeping the installation cost low and adding little to the total system thickness.

The invention relates to a component used in a railway, in particular to a high-speed railway noise barrier which comprises an H-shaped steel metal upright column, a precast concrete sound absorbing plate which is inserted into the H-shaped steel metal upright column, a transparent sound insulation plate installed above the precast concrete sound absorbing plate and an arc sound absorbing top part arranged at the top part of the transparent sound insulation plate. The high-speed railway noise barrier with the arc sound absorbing top part structure can efficiently absorb the noises of a high-speed railway train wheel rail, aerodynamic force of a train body and the like and prevent the noises from spreading to both sides of a line; and an insertion plate of a precast prestressed concrete unit at the lower part has no tensile stress under the load, thereby efficiently preventing the insertion plate from cracking and achieving the advantages of good anti-fatigue performance and durability, and the sound absorbing insertion plate of the prestressed concrete noise barrier has a low manufacturing cost and is convenient for installation and replacement. The high-speed railway noise barrier is suitable for places which have high requirements for noise isolation, such as urban regions, schools, hospitals, residential areas and the like.

An integrated circuit includes a substrate, a noise sensitive circuit, and a first low impedance guard ring. The substrate includes a well-doped blocking ring that at least partially surrounds the noise sensitive circuit. The noise sensitive circuit is fabricated on the substrate. The first low impedance guard ring is fabricated on the substrate to at least partially surround the well-doped blocking ring, wherein the first low impedance guard ring is operably coupled to a first circuit ground, wherein impedance of the first low impedance guard ring is substantially less than impedance of the well-doped blocking ring.

Multiple scribe seals are provided around an integrated circuit on a die to attain enhanced substrate noise isolation. In one embodiment, an inner scribe seal prevents mobile ions from entering the integrated circuit, and an outer scribe seal provides mechanical strength to the die. In addition, both the inner scribe seal and the outer scribe seal are designed to offer high resistance path to substrate noise. Due to the high resistance, the noise that would be coupled to various portions of the integrated circuit may be reduced.

A method of forming a semiconductor structure, comprising: providing a substrate having a buried insulative layer and a heavily doped layer; forming a first trench within the substrate around a protected area; filling the first trench with an insulative material, wherein the first trench filled with the insulative material and the buried insulative layer combine to form a high impedance noise isolation that surrounds the protected area on all sides except one side of the protected area to isolate noise from the protected area; forming a second trench within the substrate around the first trench; and filling the second trench with a conductive material, wherein the second trench filled with the conductive material and the heavily doped layer combine to form a low impedance ground path that surrounds the high impedance noise isolation on all sides except one side of the high impedance noise isolation to isolate noise from the protected area.

A noise isolation device includes a plurality of panels comprising a sound absorbent material for assembling into an enclosure for a pump mechanism and a plurality of fasteners built into the panels for assembling the panels to form an enclosure for a pump mechanism and for disassembling the panels to remove the enclosure from the pump mechanism.

There is provided a noise isolation sheet 10 which is comprised of an optional number of closed-cell foamed layer 11, open-cell foamed layer 12 and fibered noise absorbing material 13, being laminated in an optional order, and which insulates the noise near 1000 Hz. Further, there is provided a noise isolation sheet 10 comprised of an optional number of the closed-cell foamed layer 11 and the fibered noise absorbing material 13 being laminated in an optional order. There is also provided a noise isolation sheet 10 comprised of an optional number of the open-cell foamed layer 12 and the fibered noise absorbing material 13 being laminated in an optional order. Each noise isolation sheet 10 is used to partially or fully cover an interior side of a door inner panel of a vehicle.

A high-frequency noise isolation structure and a method for forming the same are provided. The noise isolation structure isolates a first device region and a second device region over a semiconductor substrate. The noise isolation structure preferably includes a sinker region substantially encircling a first device region, a buried layer underlying the first device region and joining the sinker region, a deep guard ring substantially encircling the sinker region, and a deep trench oxide region substantially encircling the sinker region. The isolation structure further includes a wide guard ring between the first and the second device regions. The sinker region and the buried region preferably have a high impurity concentration. Integrated circuits to be noise decoupled are preferably formed in the respective first and second device regions.

The invention belongs to the technical field of optical fiber amplifiers, which more particularly relates to a two-section erbium-doped optical fiber amplifier which has two sections and can control the gain. The optical fiber amplifier comprises a two-section erbium-doped optical fiber amplifying part and a gain control part, wherein the two-section erbium-doped optical fiber amplifying part comprises a 980mn pump laser source, a two-section erbium-doped optical fiber, an optical isolator, a signal and pump multiplexer, and a signal and pump demultiplexer; the gain control part comprises the signal input and output and the power measurement of output return light, as well as a controller of the pump laser device. The two-section optical circuit structure can effectively isolate an ASE noise in counterpropagation, thus optimizing the noise isolation performance of the amplifier. The gain control part can implement the gain control and optimization of the amplifier by monitoring the output power of the pump laser device.

The invention discloses a splicing type plaster plate component and the container inner decoration installation method. The splicing type plaster plate component composes membrane covered plaster plates and aluminum profile buckling strips, and the aluminum profile buckling strips are arranged between two adjacent membrane covered plaster plates for connection. The splicing type plaster plate component can be used as the decoration for the container inner wall, suspended ceiling, and isolating wall, in particular as the decoration for the inner plates of the container house box in the situations of field office and living, the installation is convenient and easy and the maintenance is easy. The splicing type plaster plate component is green and environment-protective, and contains no substance harmful to the human body. The splicing type plaster plate component has the advantages of fire resistance, heat preservation, noise isolation, good waterproof performance and elegance, the splicing type plaster plate component is free of painting, the cost is reduced, and the service life of the container inner decoration is prolonged.

There is provided a door structure of an automobile, capable of being visually checked as to whether or not a peripheral edge of an opaque water.noise isolation sheet is reliably bonded to a door inner panel through the intermediary of a sealer (adhesive). With the door structure, the door inner panel of the automobile is provided with the opaque water.noise isolation sheet for ensuring watertightness and noise isolation after stopping up at least access holes of the door inner panel, and the inner peripheral edge of a transparent film substantially annular in shape is fixedly attached to the outer peripheral edge of the opaque water.noise isolation sheet, thereby forming a structure wherein the outer peripheral edge of the transparent film is bonded to the door inner panel through the intermediary of the sealer (adhesive).